Electrically disbondable compositions and related methods
Patent
·
OSTI ID:985712
- Brookline, NH
Compositions capable of rapidly curing to a strong substrate bond are removable from a surface to which the composition is bonded without damage to the underlying substrates. The compositions of the present invention may be used in both temporary and permanent bonding and coating applications.
- Research Organization:
- EIC Laboratories, Inc. (Norwood, MA)
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- FG02-05ER84227
- Assignee:
- EIC Laboratories, Inc. (Norwood, MA)
- Patent Number(s):
- 7,465,492
- Application Number:
- 11/435,622
- OSTI ID:
- 985712
- Country of Publication:
- United States
- Language:
- English
Reworkable Epoxies: Thermosets with Thermally Cleavable Groups for Controlled Network Breakdown
|
journal | June 1998 |
Cleavable Thermosetting Epoxies: a Tool for Monitoring Cure Chemistry Perturbation at an Interface
|
journal | January 1993 |
Synthesis and Characterization of Thermally Degradable Polymer Networks
|
journal | December 1998 |
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