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Title: Comparative Study of Low-temperature PECVD of Amorphous Silicon using Mono-, Di-, Trisilane and Cyclohexasilane

Conference · · Proceedings of the 34th IEEE Photovoltaics Specialists Conference
OSTI ID:971602

The hydrogenated amorphous silicon a-Si:H films were grown by plasma-enhanced chemical vapor deposition (PECVD) using liquid cyclohexasilane Si{sub 6}H{sub 12} (CHS). The growth rate of a-Si:H was studied as a function of substrate temperatures in the range of 30 C < T < 450 C using deposition conditions that were optimized for monosilane SiH{sub 4}. The same parameters were used for a-Si:H films grown using disilane (Si{sub 2}H{sub 6}) and trisilane (Si{sub 3}H{sub 8}) precursors. It was found that the a-Si:H film growth rate for CHS is lower with respect to those for mono-, di- and trisilane in an Ar plasma. Addition of {approx}10% of H{sub 2} dramatically increases the deposition rate for CHS-based films to {_}nm/min - a 700% increase. The as-deposited films were characterized by FTIR and Raman spectroscopy to probe the hydrogen content and local bonding environment. It was found that the films grown using Ar/H{sub 2} mixtures as carrier gas have a reduced hydrogen content relative to polysilane fragments indicating higher quality amorphous silicon.

Research Organization:
North Dakota State Univ., Fargo, ND (United States)
Sponsoring Organization:
USDOE Assistant Secretary for Energy Efficiency and Renewable Energy (EE)
DOE Contract Number:
FG36-08GO88160
OSTI ID:
971602
Report Number(s):
DOE/GO/88160-5; TRN: US201206%%135
Journal Information:
Proceedings of the 34th IEEE Photovoltaics Specialists Conference, Conference: 34th IEEE Photovoltaics Specialists Conference, Philadelphia, PA, 06/07/2009-06/12/2009
Country of Publication:
United States
Language:
English