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Title: Experiment-Based Computational Investigation of Thermomechanical Stresses in Flip Chip BGA Using the ATC4.2 Test Vehicle

Abstract

Stress measurement test chips were flip chip assembled to organic BGA substrates containing micro-vias and epoxy build-up interconnect layers. Mechanical degradation observed during temperature cycling was correlated to a damage theory developed based on 3D finite element method analysis. Degradation included die cracking, edge delamination and radial fillet cracking.

Authors:
; ; ;
Publication Date:
Research Org.:
Sandia National Labs., Albuquerque, NM (US); Sandia National Labs., Livermore, CA (US)
Sponsoring Org.:
US Department of Energy (US)
OSTI Identifier:
9685
Report Number(s):
SAND99-1999C
TRN: AH200125%%5
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Conference
Resource Relation:
Conference: Surface Mount Technology Association (SMTA) International, San Jose, CA (US), 09/12/1999--09/16/1999; Other Information: PBD: 2 Aug 1999
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING; THERMOMECHANICAL TREATMENTS; THERMAL CYCLING; INTEGRATED CIRCUITS; FINITE ELEMENT METHOD; STRESSES; SUBSTRATES; FLIP CHIP; PIEZORESISTOR STRESS MEASUREMENT; DIE STRESSES

Citation Formats

Burchett, Steven N., Nguyen, Luu, Peterson, David W., and Sweet, James N. Experiment-Based Computational Investigation of Thermomechanical Stresses in Flip Chip BGA Using the ATC4.2 Test Vehicle. United States: N. p., 1999. Web.
Burchett, Steven N., Nguyen, Luu, Peterson, David W., & Sweet, James N. Experiment-Based Computational Investigation of Thermomechanical Stresses in Flip Chip BGA Using the ATC4.2 Test Vehicle. United States.
Burchett, Steven N., Nguyen, Luu, Peterson, David W., and Sweet, James N. Mon . "Experiment-Based Computational Investigation of Thermomechanical Stresses in Flip Chip BGA Using the ATC4.2 Test Vehicle". United States. https://www.osti.gov/servlets/purl/9685.
@article{osti_9685,
title = {Experiment-Based Computational Investigation of Thermomechanical Stresses in Flip Chip BGA Using the ATC4.2 Test Vehicle},
author = {Burchett, Steven N. and Nguyen, Luu and Peterson, David W. and Sweet, James N.},
abstractNote = {Stress measurement test chips were flip chip assembled to organic BGA substrates containing micro-vias and epoxy build-up interconnect layers. Mechanical degradation observed during temperature cycling was correlated to a damage theory developed based on 3D finite element method analysis. Degradation included die cracking, edge delamination and radial fillet cracking.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1999},
month = {8}
}

Conference:
Other availability
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