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Title: Coupled Finite Element ? Potts Model Simulations of Grain Growth in Copper Interconnects

Abstract

The paper addresses grain growth in copper interconnects in the presence of thermal expansion mismatch stresses. The evolution of grain structure and texture in copper in the simultaneous presence of two driving forces, curvature and elastic stored energy difference, is modeled by using a hybrid Potts model simulation approach. The elastic stored energy is calculated by using the commercial finite element code ABAQUS, where the effect of elastic anisotropy on the thermal mismatch stress and strain distribution within a polycrystalline grain structure is modeled through a user material (UMAT) interface. Parametric studies on the effect of trench width and the height of the overburden were carried out. The results show that the grain structure and texture evolution are significantly altered by the presence of elastic strain energy.

Authors:
 [1];  [1]
  1. ORNL
Publication Date:
Research Org.:
Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Center for Computational Sciences
Sponsoring Org.:
USDOE Laboratory Directed Research and Development (LDRD) Program
OSTI Identifier:
964328
DOE Contract Number:  
DE-AC05-00OR22725
Resource Type:
Conference
Resource Relation:
Conference: Materials Research Society, San Francisco, CA, USA, 20090414, 20090417
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; COPPER; GRAIN GROWTH; STRAINS; STRESSES; TEXTURE; THERMAL EXPANSION; ELECTRIC CONTACTS; MATHEMATICAL MODELS; FINITE ELEMENT METHOD; PARAMETRIC ANALYSIS; microstructure; texture; simulation

Citation Formats

Radhakrishnan, Balasubramaniam, and Gorti, Sarma B. Coupled Finite Element ? Potts Model Simulations of Grain Growth in Copper Interconnects. United States: N. p., 2009. Web.
Radhakrishnan, Balasubramaniam, & Gorti, Sarma B. Coupled Finite Element ? Potts Model Simulations of Grain Growth in Copper Interconnects. United States.
Radhakrishnan, Balasubramaniam, and Gorti, Sarma B. Thu . "Coupled Finite Element ? Potts Model Simulations of Grain Growth in Copper Interconnects". United States.
@article{osti_964328,
title = {Coupled Finite Element ? Potts Model Simulations of Grain Growth in Copper Interconnects},
author = {Radhakrishnan, Balasubramaniam and Gorti, Sarma B},
abstractNote = {The paper addresses grain growth in copper interconnects in the presence of thermal expansion mismatch stresses. The evolution of grain structure and texture in copper in the simultaneous presence of two driving forces, curvature and elastic stored energy difference, is modeled by using a hybrid Potts model simulation approach. The elastic stored energy is calculated by using the commercial finite element code ABAQUS, where the effect of elastic anisotropy on the thermal mismatch stress and strain distribution within a polycrystalline grain structure is modeled through a user material (UMAT) interface. Parametric studies on the effect of trench width and the height of the overburden were carried out. The results show that the grain structure and texture evolution are significantly altered by the presence of elastic strain energy.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Thu Jan 01 00:00:00 EST 2009},
month = {Thu Jan 01 00:00:00 EST 2009}
}

Conference:
Other availability
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