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Title: New microcrack network generation in TSMTG YBCO.

Abstract

Melt Textured YBa{sub 2}Cu{sub 3}O{sub 7}/Y{sub 2}BaCuO{sub 5} (Y123/Y211) and Y123/Y211/CeO{sub 2} composites, have been grown by Top Seeding Melt Texturing growth (TSMTG). The initial powder mixture has been densified, through a pre-melting process carried out at 1000-1050 C under O{sub 2} atmosphere. This process leads to a strongly decreased porosity of the pellet. Afterwards, TSMTG is carried out in air atmosphere. The influence of the pre-melting process on the final microstructure has been analyzed by optical and scanning electron microscopy (SEM). Microstructural analysis reveals a high microcracking density. Three well defined microcrack orientations have been detected, one parallel the (001) planes and a new class of microcrack parallel the {l_brace}100{r_brace} planes. The latter is being produced by the pre-melting densification process, while the usual microcrack parallel to (00l) planes also prevail. The influence of the oxygenation process and the Ce additives on the development of this new class of microcrack pattern will be discussed. Finally, the influence of the new microcrack network on the critical current density will be presented.

Authors:
; ; ; ; ; ; ; ; ; ; ;
Publication Date:
Research Org.:
Argonne National Lab. (ANL), Argonne, IL (United States)
Sponsoring Org.:
USDOE Office of Science (SC)
OSTI Identifier:
963623
Report Number(s):
ANL/MSD/CP-117329
TRN: US200918%%1
DOE Contract Number:  
DE-AC02-06CH11357
Resource Type:
Conference
Resource Relation:
Journal Name: J. Phys.: Conf. Ser.; Journal Volume: 43; Journal Issue: 1 ; 2006; Conference: 7th European Conference on Applied Superconductivity; Sep. 11, 2005 - Sep. 15, 2005; Vienna, Austria
Country of Publication:
United States
Language:
ENGLISH
Subject:
36 MATERIALS SCIENCE; YTTRIUM OXIDES; BARIUM OXIDES; COPPER OXIDES; CERIUM OXIDES; COMPOSITE MATERIALS; CRYSTAL GROWTH; MICROSTRUCTURE; CRACK PROPAGATION; CRACKS; ORIENTATION; CRITICAL CURRENT; CURRENT DENSITY

Citation Formats

Carrillo, A. E., Puig, T., Palau, A., Obradors, X., Zheng, H., Chen, L., Paulikas, A. P., Veal, B. W., Claus, H., Materials Science Division, CSIC, and Univ. Illinois at Chicago. New microcrack network generation in TSMTG YBCO.. United States: N. p., 2006. Web. doi:10.1088/1742-6596/43/1/099.
Carrillo, A. E., Puig, T., Palau, A., Obradors, X., Zheng, H., Chen, L., Paulikas, A. P., Veal, B. W., Claus, H., Materials Science Division, CSIC, & Univ. Illinois at Chicago. New microcrack network generation in TSMTG YBCO.. United States. doi:10.1088/1742-6596/43/1/099.
Carrillo, A. E., Puig, T., Palau, A., Obradors, X., Zheng, H., Chen, L., Paulikas, A. P., Veal, B. W., Claus, H., Materials Science Division, CSIC, and Univ. Illinois at Chicago. Sun . "New microcrack network generation in TSMTG YBCO.". United States. doi:10.1088/1742-6596/43/1/099.
@article{osti_963623,
title = {New microcrack network generation in TSMTG YBCO.},
author = {Carrillo, A. E. and Puig, T. and Palau, A. and Obradors, X. and Zheng, H. and Chen, L. and Paulikas, A. P. and Veal, B. W. and Claus, H. and Materials Science Division and CSIC and Univ. Illinois at Chicago},
abstractNote = {Melt Textured YBa{sub 2}Cu{sub 3}O{sub 7}/Y{sub 2}BaCuO{sub 5} (Y123/Y211) and Y123/Y211/CeO{sub 2} composites, have been grown by Top Seeding Melt Texturing growth (TSMTG). The initial powder mixture has been densified, through a pre-melting process carried out at 1000-1050 C under O{sub 2} atmosphere. This process leads to a strongly decreased porosity of the pellet. Afterwards, TSMTG is carried out in air atmosphere. The influence of the pre-melting process on the final microstructure has been analyzed by optical and scanning electron microscopy (SEM). Microstructural analysis reveals a high microcracking density. Three well defined microcrack orientations have been detected, one parallel the (001) planes and a new class of microcrack parallel the {l_brace}100{r_brace} planes. The latter is being produced by the pre-melting densification process, while the usual microcrack parallel to (00l) planes also prevail. The influence of the oxygenation process and the Ce additives on the development of this new class of microcrack pattern will be discussed. Finally, the influence of the new microcrack network on the critical current density will be presented.},
doi = {10.1088/1742-6596/43/1/099},
journal = {J. Phys.: Conf. Ser.},
number = 1 ; 2006,
volume = 43,
place = {United States},
year = {Sun Jan 01 00:00:00 EST 2006},
month = {Sun Jan 01 00:00:00 EST 2006}
}

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