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Title: Microsystem product development.

Abstract

Over the last decade the successful design and fabrication of complex MEMS (MicroElectroMechanical Systems), optical circuits and ASICs have been demonstrated. Packaging and integration processes have lagged behind MEMS research but are rapidly maturing. As packaging processes evolve, a new challenge presents itself, microsystem product development. Product development entails the maturation of the design and all the processes needed to successfully produce a product. Elements such as tooling design, fixtures, gages, testers, inspection, work instructions, process planning, etc., are often overlooked as MEMS engineers concentrate on design, fabrication and packaging processes. Thorough, up-front planning of product development efforts is crucial to the success of any project.

Authors:
;
Publication Date:
Research Org.:
Sandia National Laboratories
Sponsoring Org.:
USDOE
OSTI Identifier:
952114
Report Number(s):
SAND2006-1157C
TRN: US200913%%308
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Conference
Resource Relation:
Conference: Proposed for presentation at the DTIP 2006 (Design Test Integration and Packaging of MEMS on MOMEMS) held April 26-28, 2006 in Stresa, Italy.
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING; MICROELECTRONICS; DESIGN; FABRICATION; PACKAGING; MATERIALS HANDLING EQUIPMENT; PLANNING

Citation Formats

Polosky, Marc A., and Garcia, Ernest J. Microsystem product development.. United States: N. p., 2006. Web.
Polosky, Marc A., & Garcia, Ernest J. Microsystem product development.. United States.
Polosky, Marc A., and Garcia, Ernest J. Sat . "Microsystem product development.". United States. doi:.
@article{osti_952114,
title = {Microsystem product development.},
author = {Polosky, Marc A. and Garcia, Ernest J.},
abstractNote = {Over the last decade the successful design and fabrication of complex MEMS (MicroElectroMechanical Systems), optical circuits and ASICs have been demonstrated. Packaging and integration processes have lagged behind MEMS research but are rapidly maturing. As packaging processes evolve, a new challenge presents itself, microsystem product development. Product development entails the maturation of the design and all the processes needed to successfully produce a product. Elements such as tooling design, fixtures, gages, testers, inspection, work instructions, process planning, etc., are often overlooked as MEMS engineers concentrate on design, fabrication and packaging processes. Thorough, up-front planning of product development efforts is crucial to the success of any project.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Sat Apr 01 00:00:00 EST 2006},
month = {Sat Apr 01 00:00:00 EST 2006}
}

Conference:
Other availability
Please see Document Availability for additional information on obtaining the full-text document. Library patrons may search WorldCat to identify libraries that hold this conference proceeding.

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