Strength of Silicon Wafers: Fracture Mechanics Approach
Journal Article
·
· International Journal of Fracture
This paper describes a model to predict mechanical strength distribution of silicon wafers. A generalized expression, based on a multimodal Weibull distribution, is proposed to describe the strength of a brittle material with surface, edge, and bulk flaws. The specific case of a cast, unpolished photovoltaic (PV) wafer is further analyzed. Assuming that surface microcracks constitute the dominant mechanism of wafer breakage, this model predicts the strength distribution of PV silicon that matches well the experimental results available in the literature.
- Research Organization:
- National Renewable Energy Lab. (NREL), Golden, CO (United States)
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- AC36-99-GO10337
- OSTI ID:
- 951018
- Journal Information:
- International Journal of Fracture, Vol. 155, Issue 1, 2009; ISSN 0376-9429
- Country of Publication:
- United States
- Language:
- English
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