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Title: Plane-strain bulge test for nanocrystalline copper thin films

Abstract

Free-standing nanocrystalline Cu films with grain size around 39 nm are fabricated by thermal evaporation and characterized by the plane-strain bulge test. Young's modulus and yield stress at a 0.2% offset are about 110-130 GPa and 400 MPa, respectively. Results show that the strength of the n-Cu films is largely independent of film thickness at a strain rate less than 10{sup -5} s{sup -1}. No grain growth is observed and the predominant plastic deformation mechanism is grain boundary sliding accompanied by dislocation mechanisms.

Authors:
 [1];  [1];  [2];  [1];  [1]
  1. Columbia University
  2. ORNL
Publication Date:
Research Org.:
Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Shared Research Equipment Collaborative Research Center
Sponsoring Org.:
USDOE Office of Science (SC)
OSTI Identifier:
931755
DOE Contract Number:  
DE-AC05-00OR22725
Resource Type:
Journal Article
Resource Relation:
Journal Name: Scripta Materialia; Journal Volume: 57; Journal Issue: 6
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; 77 NANOSCIENCE AND NANOTECHNOLOGY; COPPER; NANOSTRUCTURES; DISLOCATIONS; GRAIN SIZE; STRAIN RATE; THIN FILMS; YOUNG MODULUS; YIELD STRENGTH

Citation Formats

Wei, Xiaoding, Lee, Dongyun, Shim, Sang Hoon, Chen, Xi, and Kysar, Jeffrey. Plane-strain bulge test for nanocrystalline copper thin films. United States: N. p., 2007. Web. doi:10.1016/j.scriptamat.2007.05.012.
Wei, Xiaoding, Lee, Dongyun, Shim, Sang Hoon, Chen, Xi, & Kysar, Jeffrey. Plane-strain bulge test for nanocrystalline copper thin films. United States. doi:10.1016/j.scriptamat.2007.05.012.
Wei, Xiaoding, Lee, Dongyun, Shim, Sang Hoon, Chen, Xi, and Kysar, Jeffrey. Mon . "Plane-strain bulge test for nanocrystalline copper thin films". United States. doi:10.1016/j.scriptamat.2007.05.012.
@article{osti_931755,
title = {Plane-strain bulge test for nanocrystalline copper thin films},
author = {Wei, Xiaoding and Lee, Dongyun and Shim, Sang Hoon and Chen, Xi and Kysar, Jeffrey},
abstractNote = {Free-standing nanocrystalline Cu films with grain size around 39 nm are fabricated by thermal evaporation and characterized by the plane-strain bulge test. Young's modulus and yield stress at a 0.2% offset are about 110-130 GPa and 400 MPa, respectively. Results show that the strength of the n-Cu films is largely independent of film thickness at a strain rate less than 10{sup -5} s{sup -1}. No grain growth is observed and the predominant plastic deformation mechanism is grain boundary sliding accompanied by dislocation mechanisms.},
doi = {10.1016/j.scriptamat.2007.05.012},
journal = {Scripta Materialia},
number = 6,
volume = 57,
place = {United States},
year = {Mon Jan 01 00:00:00 EST 2007},
month = {Mon Jan 01 00:00:00 EST 2007}
}