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Title: High Density Interconnect Multi-Chip Module for the Front-End Electronics of the PHENIX MVD

Abstract

A multi-chip module (MCM) based on High Density Interconnect (HDI) technology was developed for the front-end electronics of a high energy nuclear physics experiment to process charge pulses from silicon detectors. Stringent requirements in performance as well as low radiation length and minimum physical size of the module dictated the use of the most sophisticated MCM technology available. The module handles 256 input channels on an alumina substrate with milled cavities for die placements and four layers of thin-film traces of 42u width. A total of 20 custom integrated circuit chips and 98 passive components are assembled on a substrate of size 43 mmx48 mm. Various aspects of development efforts for the design and fabrication as well as the electrical test results of the module are discussed.

Authors:
 [1];  [1];  [2];  [2];  [1];  [2];  [2];  [2];  [2];  [2];  [2];  [2]
  1. Los Alamos National Laboratory (LANL)
  2. ORNL
Publication Date:
Research Org.:
Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)
Sponsoring Org.:
USDOE Office of Science (SC)
OSTI Identifier:
931598
DOE Contract Number:  
DE-AC05-00OR22725
Resource Type:
Conference
Resource Relation:
Conference: IEEE Nuclear Science Symposium and Medical Imaging Conference, Seattle, WA, USA, 19991026, 19991030
Country of Publication:
United States
Language:
English
Subject:
73 NUCLEAR PHYSICS AND RADIATION PHYSICS; CAVITIES; DESIGN; FABRICATION; INTEGRATED CIRCUITS; NUCLEAR PHYSICS; PERFORMANCE; RADIATION LENGTH; SILICON; SUBSTRATES

Citation Formats

Hahn, S. F., Sullivan, J P., Van Hecke, Hubert Wilhelmus, Gillo, Jehanne, Smith, G. D., Schlei, Bernd Robert, Sun, An, Young, Glenn R, Britton Jr, Charles L, Ericson, Milton Nance, Emery, M S, and Bobrek, Miljko. High Density Interconnect Multi-Chip Module for the Front-End Electronics of the PHENIX MVD. United States: N. p., 2000. Web.
Hahn, S. F., Sullivan, J P., Van Hecke, Hubert Wilhelmus, Gillo, Jehanne, Smith, G. D., Schlei, Bernd Robert, Sun, An, Young, Glenn R, Britton Jr, Charles L, Ericson, Milton Nance, Emery, M S, & Bobrek, Miljko. High Density Interconnect Multi-Chip Module for the Front-End Electronics of the PHENIX MVD. United States.
Hahn, S. F., Sullivan, J P., Van Hecke, Hubert Wilhelmus, Gillo, Jehanne, Smith, G. D., Schlei, Bernd Robert, Sun, An, Young, Glenn R, Britton Jr, Charles L, Ericson, Milton Nance, Emery, M S, and Bobrek, Miljko. Thu . "High Density Interconnect Multi-Chip Module for the Front-End Electronics of the PHENIX MVD". United States.
@article{osti_931598,
title = {High Density Interconnect Multi-Chip Module for the Front-End Electronics of the PHENIX MVD},
author = {Hahn, S. F. and Sullivan, J P. and Van Hecke, Hubert Wilhelmus and Gillo, Jehanne and Smith, G. D. and Schlei, Bernd Robert and Sun, An and Young, Glenn R and Britton Jr, Charles L and Ericson, Milton Nance and Emery, M S and Bobrek, Miljko},
abstractNote = {A multi-chip module (MCM) based on High Density Interconnect (HDI) technology was developed for the front-end electronics of a high energy nuclear physics experiment to process charge pulses from silicon detectors. Stringent requirements in performance as well as low radiation length and minimum physical size of the module dictated the use of the most sophisticated MCM technology available. The module handles 256 input channels on an alumina substrate with milled cavities for die placements and four layers of thin-film traces of 42u width. A total of 20 custom integrated circuit chips and 98 passive components are assembled on a substrate of size 43 mmx48 mm. Various aspects of development efforts for the design and fabrication as well as the electrical test results of the module are discussed.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2000},
month = {6}
}

Conference:
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