Effect of Aggregation and Interfacial Thermal Resistance on Thermal Conductivity of Nanocomposites and Colloidal Nanofluids

Journal Article · Sat Mar 01 00:00:00 EST 2008 · International Journal for Heat and Mass Transfer

DOI:https://doi.org/10.1016/j.ijheatmasstransfer.2007.10.017· OSTI ID:927438

Evans, William; Prasher, Ravi; Fish, Jacob; Meakin, Paul; Phelan, Patrick; Keblinski, Pawel

We analyzed the role of aggregation and interfacial thermal resistance on the effective thermal conductivity of nanofluids and nanocomposites. We found that the thermal conductivity of nanofluids and nanocomposites can be significantly enhanced by the aggregation of nanoparticles into clusters. The value of the thermal conductivity enhancement is determined by the cluster morphology, filler conductivity and interfacial thermal resistance. We also compared thermal conductivity enhancement due to aggregation with that associated with high-aspect ratio fillers, including fibers and plates.

• Research Organization: Idaho National Lab. (INL), Idaho Falls, ID (United States)
• Sponsoring Organization: DOE - SC
• DOE Contract Number: DE-AC07-99ID-13727
• OSTI ID: 927438
• Report Number(s): INL/JOU-07-13325; TRN: US200811%%231
• Journal Information: International Journal for Heat and Mass Transfer, Vol. 51, Issue 5 - 6
• Country of Publication: United States
• Language: English

Related Subjects

99 GENERAL AND MISCELLANEOUS//MATHEMATICS, COMPUTING, AND INFORMATION SCIENCE
FIBERS
FILLERS
MORPHOLOGY
PLATES
THERMAL CONDUCTIVITY
aggregation
homogenization model
interfacial thermal resistance
Monte Carlo simulation
nanoparticles
thermal conductivity