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Title: Growth and characterization of copper nanoclusters embedded in SiCmatrix

Authors:
; ; ; ; ; ;
Publication Date:
Research Org.:
COLLABORATION - StanfordU.
OSTI Identifier:
924843
Report Number(s):
LBNL-57737
R&D Project: 458111; BnR: KC0204016
DOE Contract Number:
DE-AC02-05CH11231
Resource Type:
Journal Article
Resource Relation:
Journal Name: Thin Solid Films; Journal Volume: 473; Related Information: Journal Publication Date: 2005
Country of Publication:
United States
Language:
English
Subject:
36; advanced light source als

Citation Formats

Shin, Dong-Woon, Wang, Shan X., Marshall, Ann F., Kimura, Wataru, Dong, Chungli, Augustsson, Andreas, and Guo, Jinghua. Growth and characterization of copper nanoclusters embedded in SiCmatrix. United States: N. p., 2005. Web. doi:10.1016/j.tsf.2004.07.079.
Shin, Dong-Woon, Wang, Shan X., Marshall, Ann F., Kimura, Wataru, Dong, Chungli, Augustsson, Andreas, & Guo, Jinghua. Growth and characterization of copper nanoclusters embedded in SiCmatrix. United States. doi:10.1016/j.tsf.2004.07.079.
Shin, Dong-Woon, Wang, Shan X., Marshall, Ann F., Kimura, Wataru, Dong, Chungli, Augustsson, Andreas, and Guo, Jinghua. Fri . "Growth and characterization of copper nanoclusters embedded in SiCmatrix". United States. doi:10.1016/j.tsf.2004.07.079.
@article{osti_924843,
title = {Growth and characterization of copper nanoclusters embedded in SiCmatrix},
author = {Shin, Dong-Woon and Wang, Shan X. and Marshall, Ann F. and Kimura, Wataru and Dong, Chungli and Augustsson, Andreas and Guo, Jinghua},
abstractNote = {},
doi = {10.1016/j.tsf.2004.07.079},
journal = {Thin Solid Films},
number = ,
volume = 473,
place = {United States},
year = {Fri Dec 02 00:00:00 EST 2005},
month = {Fri Dec 02 00:00:00 EST 2005}
}
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