Method and system using power modulation for maskless vapor deposition of spatially graded thin film and multilayer coatings with atomic-level precision and accuracy
- Livermore, CA
- San Jose, CA
- New City, NY
A method and system for producing a film (preferably a thin film with highly uniform or highly accurate custom graded thickness) on a flat or graded substrate (such as concave or convex optics), by sweeping the substrate across a vapor deposition source operated with time-varying flux distribution. In preferred embodiments, the source is operated with time-varying power applied thereto during each sweep of the substrate to achieve the time-varying flux distribution as a function of time. A user selects a source flux modulation recipe for achieving a predetermined desired thickness profile of the deposited film. The method relies on precise modulation of the deposition flux to which a substrate is exposed to provide a desired coating thickness distribution.
- Research Organization:
- Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)
- Sponsoring Organization:
- USDOE
- Assignee:
- Montcalm, Claude (Livermore, CA); Folta, James Allen (Livermore, CA); Tan, Swie-In (San Jose, CA); Reiss, Ira (New City, NY
- Patent Number(s):
- 6,425,988
- Application Number:
- 09/711,441
- OSTI ID:
- 921900
- Country of Publication:
- United States
- Language:
- English
Multilayer coating of 10X projection optics for extreme ultraviolet lithography
|
conference | June 1999 |
Advances in multilayer reflective coatings for extreme ultraviolet lithography
|
conference | June 1999 |
Advances in the reduction and compensation of film stress in high-reflectance multilayer coatings for extreme-ultraviolet lithography
|
conference | June 1998 |
Design and performance of graded multilayers as focusing elements for x-ray optics
|
journal | August 1999 |
Similar Records
Method and system for producing sputtered thin films with sub-angstrom thickness uniformity or custom thickness gradients
Maskless deposition technique for the physical vapor deposition of thin film and multilayer coatings with subnanometer precision and accuracy