skip to main content
OSTI.GOV title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Microelectromechanical systems contact stress sensor

Abstract

A microelectromechanical systems stress sensor comprising a microelectromechanical systems silicon body. A recess is formed in the silicon body. A silicon element extends into the recess. The silicon element has limited freedom of movement within the recess. An electrical circuit in the silicon element includes a piezoresistor material that allows for sensing changes in resistance that is proportional to bending of the silicon element.

Inventors:
 [1]
  1. Oakland, CA
Publication Date:
Research Org.:
Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
921497
Patent Number(s):
7,311,009
Application Number:
11/143,543
Assignee:
Lawrence Livermore National Security, LLC (Livermore, CA)
DOE Contract Number:  
W-7405-ENG-48
Resource Type:
Patent
Country of Publication:
United States
Language:
English

Citation Formats

Kotovsky, Jack. Microelectromechanical systems contact stress sensor. United States: N. p., 2007. Web.
Kotovsky, Jack. Microelectromechanical systems contact stress sensor. United States.
Kotovsky, Jack. 2007. "Microelectromechanical systems contact stress sensor". United States. https://www.osti.gov/servlets/purl/921497.
@article{osti_921497,
title = {Microelectromechanical systems contact stress sensor},
author = {Kotovsky, Jack},
abstractNote = {A microelectromechanical systems stress sensor comprising a microelectromechanical systems silicon body. A recess is formed in the silicon body. A silicon element extends into the recess. The silicon element has limited freedom of movement within the recess. An electrical circuit in the silicon element includes a piezoresistor material that allows for sensing changes in resistance that is proportional to bending of the silicon element.},
doi = {},
url = {https://www.osti.gov/biblio/921497}, journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Dec 25 00:00:00 EST 2007},
month = {Tue Dec 25 00:00:00 EST 2007}
}

Works referenced in this record:

A miniature piezoelectric polymer transducer for in vitro measurement of the dynamic contact stress distribution
journal, June 1992


Development of a new contact-type piezoresistive micro-shear-stress sensor
conference, April 2002

  • Hsieh, M. C.; Fang, Yean-Kuen; Ju, M. S.
  • Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS 2002, SPIE Proceedings
  • https://doi.org/10.1117/12.462822

Flexible miniature ribbon cables for long-term connection to implantable sensors
journal, April 1990


New tactile sensor chip with silicone rubber cover
journal, September 2000


Silicon ribbon cables for chronically implantable microelectrode arrays
journal, April 1994


A flexible MEMS technology and its first application to shear stress sensor skin
conference, January 1997

  • Fukang Jiang, ; Walsh, K.
  • Proceedings IEEE The Tenth Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Robots
  • https://doi.org/10.1109/MEMSYS.1997.581894

Review Article Tactile sensing for mechatronics—a state of the art survey
journal, February 1999