Extreme-UV lithography vacuum chamber zone seal

Patent · 08 April 2003

OSTI ID:921441

Haney, Steven J ^[1]; Herron, Donald Joe ^[2]; Klebanoff, Leonard E ^[3]; Replogle, William C ^[4]

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1. Tracy, CA
2. Manteca, CA
3. San Ramon, CA
4. Livermore, CA

Control of particle contamination on the reticle and carbon contamination of optical surfaces in photolithography systems can be achieved by the establishment of multiple pressure zones in the photolithography systems. The different zones will enclose the reticle, projection optics, wafer, and other components of system. The system includes a vacuum apparatus that includes: a housing defining a vacuum chamber; one or more metrology trays situated within the vacuum chamber each of which is supported by at least one support member, wherein the tray separates the vacuum chamber into a various compartments that are maintained at different pressures; and conductance seal devices for adjoining the perimeter of each tray to an inner surface of the housing wherein the tray is decoupled from vibrations emanating from the inner surface of the housing.

• Research Organization: Sandia Corporation
• Sponsoring Organization: United States Department of Energy
• DOE Contract Number: AC04-94AL85000
• Assignee: EUV LLC (Santa Clara, CA)
• Patent Number(s): 6,545,745
• Application Number: 09/985,876
• OSTI ID: 921441
• Country of Publication: United States
• Language: English