Real Time Study of Cu Diffusion Through a Ru Thin Film by Photoemission Electron Microscopy (PEEM)

Conference · Mon Oct 01 00:00:00 EDT 2007

OSTI ID:921427

Wei, Wei; Xiong, Gang; Sun, Yuming; Joly, Alan G; Beck, Kenneth M; White, J M; Hess, Wayne P

We demonstrate the efficacy of Photoemission Electron Microscopy (PEEM) as a tool to detect metal diffusion processes at nanoscale spatial resolution in real time. For a sample comprising a nominally 1nm physical vapor-deposited (PVD) Ru thin film covering a thick Cu substrate, we have observed the appearance of bright features on a dark background as the temperature is monotonically increased and irradiated with photons from a Hg are lamp. These bright features are the result of a lower work function due to Cu diffusion through the Ru films.

• Research Organization: Pacific Northwest National Lab. (PNNL), Richland, WA (United States). Environmental Molecular Sciences Lab. (EMSL)
• Sponsoring Organization: USDOE
• DOE Contract Number: AC05-76RL01830
• OSTI ID: 921427
• Report Number(s): PNNL-SA-49613; 14399; KC0301020; TRN: US200804%%811
• Resource Relation: Conference: Materials, technology and reliability of low-k dielectrics and copper interconnects. Materials Research Society Symposium Proceedings; 2006, 914:185-190 (Paper no. 0914-F05-07)
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
COPPER
DIELECTRIC MATERIALS
DIFFUSION
ELECTRON MICROSCOPY
PHOTOEMISSION
PHOTONS
RELIABILITY
SPATIAL RESOLUTION
THIN FILMS
WORK FUNCTIONS
Environmental Molecular Sciences Laboratory