Real Time Study of Cu Diffusion Through a Ru Thin Film by Photoemission Electron Microscopy (PEEM)
Conference
·
OSTI ID:921427
We demonstrate the efficacy of Photoemission Electron Microscopy (PEEM) as a tool to detect metal diffusion processes at nanoscale spatial resolution in real time. For a sample comprising a nominally 1nm physical vapor-deposited (PVD) Ru thin film covering a thick Cu substrate, we have observed the appearance of bright features on a dark background as the temperature is monotonically increased and irradiated with photons from a Hg are lamp. These bright features are the result of a lower work function due to Cu diffusion through the Ru films.
- Research Organization:
- Pacific Northwest National Lab. (PNNL), Richland, WA (United States). Environmental Molecular Sciences Lab. (EMSL)
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- AC05-76RL01830
- OSTI ID:
- 921427
- Report Number(s):
- PNNL-SA-49613; 14399; KC0301020; TRN: US200804%%811
- Resource Relation:
- Conference: Materials, technology and reliability of low-k dielectrics and copper interconnects. Materials Research Society Symposium Proceedings; 2006, 914:185-190 (Paper no. 0914-F05-07)
- Country of Publication:
- United States
- Language:
- English
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