Microdiffraction: X-rays as a probe to reveal flux divergences ininterconnects
Most reliability issues in interconnect systems occur at a local scale and many of them include the local build-up of stresses. Typical failure mechanisms are electromigration and stress voiding in interconnect lines and fatigue in surface acoustic wave devices. Thus a local probe is required for the investigation of these phenomena. In this paper the application of the Laue microdiffraction technique to investigate flux divergences in interconnect systems will be described. The deviatoric strain tensor of single grains can be correlated with the local microstructure, orientation and defect density. Especially the latter led to recent results about the correlation of stress build-up and orientation in Cu lines and electromigration-induced grain rotation in Cu and Al lines.
- Research Organization:
- COLLABORATION - Laboratory forNanometallurgy/Switzerland
- Sponsoring Organization:
- USDOE Director. Office of Science. Basic EnergySciences
- DOE Contract Number:
- DE-AC02-05CH11231
- OSTI ID:
- 918914
- Report Number(s):
- LBNL-61488; R&D Project: A580ES; BnR: KC0204016; TRN: US200819%%491
- Resource Relation:
- Journal Volume: 817; Conference: Stress-Induced Phenomena in Metallization: EighthInternational Workshop on Stress-Induced Phenomena in Metallization,Dresden, Germany, Sept. 12-14, 2005
- Country of Publication:
- United States
- Language:
- English
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