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Title: System configured for applying a modifying agent to a non-equidimensional substrate

Abstract

The present invention is related to systems and methods for modifying various non-equidimensional substrates with modifying agents. The system comprises a processing chamber configured for passing the non-equidimensional substrate therethrough, wherein the processing chamber is further configured to accept a treatment mixture into the chamber during movement of the non-equidimensional substrate through the processing chamber. The treatment mixture can comprise of the modifying agent in a carrier medium, wherein the carrier medium is selected from the group consisting of a supercritical fluid, a near-critical fluid, a superheated fluid, a superheated liquid, and a liquefied gas. Thus, the modifying agent can be applied to the non-equidimensional substrate upon contact between the treatment mixture and the non-equidimensional substrate.

Inventors:
;  [1];  [1]
  1. Idaho Falls, ID
Publication Date:
Research Org.:
Idaho National Lab. (INL), Idaho Falls, ID (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
913242
Patent Number(s):
7,241,340
Application Number:
10/627,530
Assignee:
Battelle Energy Alliance, LLC (Idaho Falls, ID)
DOE Contract Number:  
AC07-94ID13223; AC07-99ID13727; AC07-05ID14517
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE

Citation Formats

Janikowski,, Stuart K., Mark D., Robert V., W Alan, Toth, William J., Daniel M., Charles A., and David, L. System configured for applying a modifying agent to a non-equidimensional substrate. United States: N. p., 2007. Web.
Janikowski,, Stuart K., Mark D., Robert V., W Alan, Toth, William J., Daniel M., Charles A., & David, L. System configured for applying a modifying agent to a non-equidimensional substrate. United States.
Janikowski,, Stuart K., Mark D., Robert V., W Alan, Toth, William J., Daniel M., Charles A., and David, L. 2007. "System configured for applying a modifying agent to a non-equidimensional substrate". United States. https://www.osti.gov/servlets/purl/913242.
@article{osti_913242,
title = {System configured for applying a modifying agent to a non-equidimensional substrate},
author = {Janikowski, and Stuart K. and Mark D. and Robert V. and W Alan, Toth and William J. and Daniel M. and Charles A. and David, L},
abstractNote = {The present invention is related to systems and methods for modifying various non-equidimensional substrates with modifying agents. The system comprises a processing chamber configured for passing the non-equidimensional substrate therethrough, wherein the processing chamber is further configured to accept a treatment mixture into the chamber during movement of the non-equidimensional substrate through the processing chamber. The treatment mixture can comprise of the modifying agent in a carrier medium, wherein the carrier medium is selected from the group consisting of a supercritical fluid, a near-critical fluid, a superheated fluid, a superheated liquid, and a liquefied gas. Thus, the modifying agent can be applied to the non-equidimensional substrate upon contact between the treatment mixture and the non-equidimensional substrate.},
doi = {},
url = {https://www.osti.gov/biblio/913242}, journal = {},
number = ,
volume = ,
place = {United States},
year = {2007},
month = {7}
}