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Title: Reproducibility Data on SUMMiT

Conference ·
OSTI ID:9014

SUMMiT (Sandia Ultra-planar Multi-level MEMS Technology) at the Sandia National Laboratories' MDL (Microelectronics Development Laboratory) is a standardized MEMS (Microelectromechanical Systems) technology that allows designers to fabricate concept prototypes. This technology provides four polysilicon layers plus three sacrificial oxide layers (with the third oxide layer being planarized) to enable fabrication of complex mechanical systems-on-a-chip. Quantified reproducibility of the SUMMiT process is important for process engineers as well as designers. Summary statistics for critical MEMS technology parameters such as film thickness, line width, and sheet resistance will be reported for the SUMMiT process. Additionally, data from Van der Pauw test structures will be presented. Data on film thickness, film uniformity and critical dimensions of etched line widths are collected from both process and monitor wafers during manufacturing using film thickness metrology tools and SEM tools. A standardized diagnostic module is included in each SWiT run to obtain post-processing parametric data to monitor run-to-run reproducibility such as Van der Pauw structures for measuring sheet resistance. This characterization of the SUMMiT process enables design for manufacturability in the SUMMiT technology.

Research Organization:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Sponsoring Organization:
USDOE Office of Defense Programs (DP) (US)
DOE Contract Number:
AC04-94AL85000
OSTI ID:
9014
Report Number(s):
SAND99-1805C; TRN: AH200122%%132
Resource Relation:
Conference: Micromachining and Microfabrication Process Technology, Santa Clara, CA (US), 09/20/1999--09/23/1999; Other Information: PBD: 16 Jul 1999
Country of Publication:
United States
Language:
English