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Title: Multilayer defects nucleated by substrate pits: a comparison of actinic inspection and non-actinic inspection techniques

Abstract

The production of defect-free mask blanks remains a key challenge for EUV lithography. Mask-blank inspection tools must be able to accurately detect all critical defects while simultaneously having the minimum possible false-positive detection rate. We have recently observed and here report the identification of bump-type buried substrate defects, that were below the detection limit of a non-actinic (i.e. non-EUV) in inspection tool. Presently, the occurrence inspection of pit-type defects, their printability, and their detectability with actinic techniques and non-actinic commercial tools, has become a significant concern. We believe that the most successful strategy for the development of effective non-actinic mask inspection tools will involve the careful cross-correlation with actinic inspection and lithographic printing. In this way, the true efficacy of prototype inspection tools now under development can be studied quantitatively against relevant benchmarks. To this end we have developed a dual-mode actinic mask inspection system capable of scanning mask blanks for defects (with simultaneous EUV bright-field and dark-field detection) and imaging those same defects with a zoneplate microscope that matches or exceeds the resolution of EUV steppers.

Authors:
; ; ; ; ; ; ;
Publication Date:
Research Org.:
Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
897930
Report Number(s):
UCRL-PROC-225851
Journal ID: ISSN 0277-786X; TRN: US200706%%131
DOE Contract Number:  
W-7405-ENG-48
Resource Type:
Conference
Resource Relation:
Journal Volume: 6349; Conference: Presented at: SPIE Photomask technology (BACUS), Monterey, CA, United States, Sep 18 - Sep 22, 2006
Country of Publication:
United States
Language:
English
Subject:
71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSICS; BENCHMARKS; DEFECTS; DETECTION; MICROSCOPES; PRODUCTION; RESOLUTION; SENSITIVITY; SUBSTRATES

Citation Formats

Barty, A, Goldberg, K, Kearney, P, Rekawa, S, LaFontaine, B, Wood, O, Taylor, J S, and Han, H. Multilayer defects nucleated by substrate pits: a comparison of actinic inspection and non-actinic inspection techniques. United States: N. p., 2006. Web. doi:10.1117/12.686742.
Barty, A, Goldberg, K, Kearney, P, Rekawa, S, LaFontaine, B, Wood, O, Taylor, J S, & Han, H. Multilayer defects nucleated by substrate pits: a comparison of actinic inspection and non-actinic inspection techniques. United States. doi:10.1117/12.686742.
Barty, A, Goldberg, K, Kearney, P, Rekawa, S, LaFontaine, B, Wood, O, Taylor, J S, and Han, H. Mon . "Multilayer defects nucleated by substrate pits: a comparison of actinic inspection and non-actinic inspection techniques". United States. doi:10.1117/12.686742. https://www.osti.gov/servlets/purl/897930.
@article{osti_897930,
title = {Multilayer defects nucleated by substrate pits: a comparison of actinic inspection and non-actinic inspection techniques},
author = {Barty, A and Goldberg, K and Kearney, P and Rekawa, S and LaFontaine, B and Wood, O and Taylor, J S and Han, H},
abstractNote = {The production of defect-free mask blanks remains a key challenge for EUV lithography. Mask-blank inspection tools must be able to accurately detect all critical defects while simultaneously having the minimum possible false-positive detection rate. We have recently observed and here report the identification of bump-type buried substrate defects, that were below the detection limit of a non-actinic (i.e. non-EUV) in inspection tool. Presently, the occurrence inspection of pit-type defects, their printability, and their detectability with actinic techniques and non-actinic commercial tools, has become a significant concern. We believe that the most successful strategy for the development of effective non-actinic mask inspection tools will involve the careful cross-correlation with actinic inspection and lithographic printing. In this way, the true efficacy of prototype inspection tools now under development can be studied quantitatively against relevant benchmarks. To this end we have developed a dual-mode actinic mask inspection system capable of scanning mask blanks for defects (with simultaneous EUV bright-field and dark-field detection) and imaging those same defects with a zoneplate microscope that matches or exceeds the resolution of EUV steppers.},
doi = {10.1117/12.686742},
journal = {},
issn = {0277-786X},
number = ,
volume = 6349,
place = {United States},
year = {2006},
month = {10}
}

Conference:
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