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Title: The Creep Behavior of In-Ag Eutectic Solder Joints

Authors:
; ;
Publication Date:
Research Org.:
Ernest Orlando Lawrence Berkeley NationalLaboratory, Berkeley, CA (US)
Sponsoring Org.:
USDOE Director, Office of Energy Research
OSTI Identifier:
895578
Report Number(s):
LBNL-41828
DOE Contract Number:  
DE-AC02-05CH11231
Resource Type:
Journal Article
Resource Relation:
Journal Name: Journal of Electronic Materials; Journal Volume: 28; Journal Issue: 1; Related Information: Journal Publication Date: Jan 1999
Country of Publication:
United States
Language:
English

Citation Formats

Reynolds, H.L., Kang, S.H., and Morris, J.W. The Creep Behavior of In-Ag Eutectic Solder Joints. United States: N. p., 1998. Web.
Reynolds, H.L., Kang, S.H., & Morris, J.W. The Creep Behavior of In-Ag Eutectic Solder Joints. United States.
Reynolds, H.L., Kang, S.H., and Morris, J.W. Fri . "The Creep Behavior of In-Ag Eutectic Solder Joints". United States. doi:.
@article{osti_895578,
title = {The Creep Behavior of In-Ag Eutectic Solder Joints},
author = {Reynolds, H.L. and Kang, S.H. and Morris, J.W.},
abstractNote = {},
doi = {},
journal = {Journal of Electronic Materials},
number = 1,
volume = 28,
place = {United States},
year = {Fri May 01 00:00:00 EDT 1998},
month = {Fri May 01 00:00:00 EDT 1998}
}