Adhesion and Thin-Film Module Reliability (Presentation)

Title: Adhesion and Thin-Film Module Reliability (Presentation)

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Abstract

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Authors:: McMahon, T. J.; Jorgensen, G. J.

Publication Date:: Mon May 01 00:00:00 EDT 2006

Research Org.:: National Renewable Energy Lab. (NREL), Golden, CO (United States)

Sponsoring Org.:: USDOE

OSTI Identifier:: 894440

Report Number(s):: NREL/PR-520-39842
TRN: US200701%%455

DOE Contract Number:: AC36-99-GO10337

Resource Type:: Conference

Resource Relation:: Conference: Prepared for the 2006 IEEE 4th World Conference on Photovoltaic Energy Conversion (WCPEC-4), 7-12 May 2006, Waikoloa, Hawaii

Country of Publication:: United States

Language:: English

Subject:: 14 SOLAR ENERGY; ADHESION; ENERGY CONVERSION; RELIABILITY; PHOTOVOLTAIC; POLYCRYSTALLINE; SOLAR; THIN FILM SOLAR CELLS; A-SI; CIGS; PV; NREL; Solar Energy - Photovoltaics

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                    McMahon, T. J., and Jorgensen, G. J. Adhesion and Thin-Film Module Reliability (Presentation).  United States: N. p., 2006. 
        Web.

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                    McMahon, T. J., & Jorgensen, G. J. Adhesion and Thin-Film Module Reliability (Presentation).  United States.

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                    McMahon, T. J., and Jorgensen, G. J. Mon .  
        "Adhesion and Thin-Film Module Reliability (Presentation)".  United States.  
        doi:.  https://www.osti.gov/servlets/purl/894440.

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@article{osti_894440,

  title        = {Adhesion and Thin-Film Module Reliability (Presentation)},

  author       = {McMahon, T. J. and Jorgensen, G. J.},

  abstractNote = {No abstract prepared.},

  doi          = {},

  journal      = {},

  number       = ,

  volume       = ,

  place        = {United States},

  year         = {Mon May 01 00:00:00 EDT 2006},

  month        = {Mon May 01 00:00:00 EDT 2006}

}

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Adhesion and Thin-Film Module Reliability: Preprint

McMahon, T. J. ; Jorgensen, G. J.

Among the infrequently measured but essential properties for thin-film (T-F) module reliability are the interlayer adhesion and cohesion within a layer. These can be cell contact layers to glass, contact layers to the semiconductor, encapsulant to cell, glass, or backsheet, etc. We use an Instron mechanical testing unit to measure peel strengths at 90{sup o} or 180{sup o} and, in some cases, a scratch and tape pull test to evaluate inter-cell layer adhesion strengths. We present peel strength data for test specimens laminated from the three T-F technologies, before and after damp heat, and in one instance at elevated temperatures.more »« less
DOI: 10.1109/WCPEC.2006.279908

Full Text Available
Adhesion and Thin-Film Module Reliability

McMahon, T. J. ; Jorgenson, G. J.

Among the infrequently measured but essential properties for thin-film (T-F) module reliability are the interlayer adhesion and cohesion within a layer. These can be cell contact layers to glass, contact layers to the semiconductor, encapsulant to cell, glass, or backsheet, etc. We use an Instron mechanical testing unit to measure peel strengths at 90deg or 180deg and, in some cases, a scratch and tape pull test to evaluate inter-cell layer adhesion strengths. We present peel strength data for test specimens laminated from the three T-F technologies, before and after damp heat, and in one instance at elevated temperatures. On laminatedmore »« less
DOI: 10.1109/WCPEC.2006.279908
Interface adhesion and coating integrity of the thin film Au-metallization for Bi2Te3-based thermoelectric module.

Yang, Nancy Y. C. ; Morales, Alfredo M. ; Scott Whalen
Examination of a Junction-Box Adhesion Test for Use in Photovoltaic Module Qualification (Presentation)

Miller, D. C. ; Wohlgemuth, J. H.

Engineering robust adhesion of the junction-box (j-box) is a hurdle typically encountered by photovoltaic (PV) module manufacturers during product development. There are historical incidences of adverse effects (e.g., fires) caused when the j-box/adhesive/module system has failed in the field. The addition of a weight to the j-box during the 'damp heat' IEC qualification test is proposed to verify the basic robustness of its adhesion system. The details of the proposed test will be described, in addition to the preliminary results obtained using representative materials and components. The described discovery experiments examine moisture-cured silicone, foam tape, and hot-melt adhesives used inmore »« less
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Defining Threshold Values of Encapsulant and Backsheet Adhesion for PV Module Reliability: Preprint

Bosco, Nicholas S ; Kurtz, Sarah ; Eafanti, Joshua ; ...

The width-tapered cantilever beam method is used to quantify the debond energy (adhesion) of encapsulant and backsheet structures of 27 modules collected from the field. The collected population of modules contains both those that have remained in-tact and those with instances of either or both encapsulant and backsheet delamination. From this survey, initial threshold values (an adhesion value above which a module should remain intact throughout its lifetime) for encapsulant and backsheet interfaces are proposed. For encapsulants this value is about 60 J/m2 and for backsheets about 20 J/m2. It is expected that these values will continue to be refinedmore »« less
DOI: 10.1109/JPHOTOV.2017.2746682

Full Text Available