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Title: Development of Damp-Heat Resistant Self-Primed EVA and Non-EVA Encapsulant Formulations at NREL

Abstract

Self-primed ethylene-vinyl acetate (EVA) and non-EVA (PMG) encapsulant formulations were developed that have greater resistance to damp heat exposure at 85 deg C and 85% relative humidity (RH) (in terms of adhesion strength to glass substrates) than a commonly used commercial EVA product. The self-primed EVA formulations were developed on the basis of high-performing glass priming formulations that have previously proven to significantly enhance the adhesion strength of unprimed and primed EVA films on glass substrates during damp heat exposure. The PMG encapsulant formulations were based on an ethylene-methylacrylate copolymer containing glycidyl methacrylate.

Authors:
;
Publication Date:
Research Org.:
National Renewable Energy Lab. (NREL), Golden, CO (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
882814
Report Number(s):
NREL/CP-520-38984
DOE Contract Number:  
AC36-99-GO10337
Resource Type:
Conference
Resource Relation:
Related Information: Presented at the 2005 DOE Solar Energy Technologies Program Review Meeting held November 7-10, 2005 in Denver, Colorado. Also included in the proceedings available on CD-ROM (DOE/GO-1020060-2245; NREL/CD-520-38577)
Country of Publication:
United States
Language:
English
Subject:
14 SOLAR ENERGY; 36 MATERIALS SCIENCE; PHOTOVOLTAICS; SOLAR; ETHYLENE-VINYL ACETATE; EVA; PV; NREL; Solar Energy - Photovoltaics

Citation Formats

Pern, F. J., and Jorgensen, G. J. Development of Damp-Heat Resistant Self-Primed EVA and Non-EVA Encapsulant Formulations at NREL. United States: N. p., 2005. Web.
Pern, F. J., & Jorgensen, G. J. Development of Damp-Heat Resistant Self-Primed EVA and Non-EVA Encapsulant Formulations at NREL. United States.
Pern, F. J., and Jorgensen, G. J. Tue . "Development of Damp-Heat Resistant Self-Primed EVA and Non-EVA Encapsulant Formulations at NREL". United States. doi:. https://www.osti.gov/servlets/purl/882814.
@article{osti_882814,
title = {Development of Damp-Heat Resistant Self-Primed EVA and Non-EVA Encapsulant Formulations at NREL},
author = {Pern, F. J. and Jorgensen, G. J.},
abstractNote = {Self-primed ethylene-vinyl acetate (EVA) and non-EVA (PMG) encapsulant formulations were developed that have greater resistance to damp heat exposure at 85 deg C and 85% relative humidity (RH) (in terms of adhesion strength to glass substrates) than a commonly used commercial EVA product. The self-primed EVA formulations were developed on the basis of high-performing glass priming formulations that have previously proven to significantly enhance the adhesion strength of unprimed and primed EVA films on glass substrates during damp heat exposure. The PMG encapsulant formulations were based on an ethylene-methylacrylate copolymer containing glycidyl methacrylate.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Nov 01 00:00:00 EST 2005},
month = {Tue Nov 01 00:00:00 EST 2005}
}

Conference:
Other availability
Please see Document Availability for additional information on obtaining the full-text document. Library patrons may search WorldCat to identify libraries that hold this conference proceeding.

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