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Title: Patterned Regions of Porous Silicon through Trapped Hydrogen Bubbles

Journal Article · · Applied Physics Letters
DOI:https://doi.org/10.1063/1.2188039· OSTI ID:881682

Hydrogen bubbles trapped around lithographically formed etch pits on silicon single crystal surfaces were used to guide the formation of patterned regions of porous silicon. Optical lithography and wet (electro) chemical etching were utilized in a series of steps to form the etched surface and guide this growth. It was observed that the pits were surrounded by round regions of porous Si suggesting that hydrogen bubbles defined the areas of porous silicon formation. Consistent with earlier results where porosity seemed to form primarily at the bubble edges, a lower overall etch rate was observed near the bubble center. This is consistent with a variable rate of bubble expansion as etching occurred and an ability of the hydrogen to mask or slow the reaction in the bubble center. Contrary to our initial expectations, the surface profile suggested that the region away from the bubbles was also etched, but very uniformly.

Research Organization:
Pacific Northwest National Lab. (PNNL), Richland, WA (United States). Environmental Molecular Sciences Lab. (EMSL)
Sponsoring Organization:
USDOE
DOE Contract Number:
AC05-76RL01830
OSTI ID:
881682
Report Number(s):
PNNL-SA-46455; APPLAB; 8220; KP1303000; TRN: US200613%%69
Journal Information:
Applied Physics Letters, Vol. 88, Issue 14; ISSN 0003-6951
Country of Publication:
United States
Language:
English