Programmable Multi-Chip Module

Patent · 16 November 2004

OSTI ID:880241

Kautz, David ^[1]; Morgenstern, Howard ^[2]; Blazek, Roy J ^[3]

---

1. Lenexa, KS
2. Lee's Summit, MO
3. Overland Park, KS

A multi-chip module comprising a low-temperature co-fired ceramic substrate having a first side on which are mounted active components and a second side on which are mounted passive components, wherein this segregation of components allows for hermetically sealing the active components with a cover while leaving accessible the passive components, and wherein the passive components are secured using a reflow soldering technique and are removable and replaceable so as to make the multi-chip module substantially programmable with regard to the passive components.

• Research Organization: Kansas City Plant (KCP), Kansas City, MO (United States)
• DOE Contract Number: AC04-01AL66850
• Assignee: Honeywell Federal Manufacturing & Technologies (Kansas City, MO)
• Patent Number(s): US 6,818,984
• Application Number: 10/697442
• OSTI ID: 880241
• Country of Publication: United States
• Language: English