Processing A Printed Wiring Board By Single Bath Electrodeposition
Patent
·
OSTI ID:879696
- Oakland, CA
- Livermore, CA
A method of processing a printed wiring board by single bath electrodeposition. Initial processing steps are implemented on the printed wiring board. Copper is plated on the printed wiring board from a bath containing nickel and copper. Nickel is plated on the printed wiring board from the bath containing nickel and copper and final processing steps are implemented on the printed wiring board.
- Research Organization:
- Lawrence Livermore National Laboratory
- DOE Contract Number:
- W-7405-ENG-48
- Assignee:
- The Regents of the University of California (Oakland, CA)
- Patent Number(s):
- US 6547946
- Application Number:
- 09/810877
- OSTI ID:
- 879696
- Country of Publication:
- United States
- Language:
- English
Electrochemical Formation of Laminar Deposits of Controlled Structure and Composition: II . Dual Current Pulse Galvanostatic Technique
|
journal | June 1989 |
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