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Title: Fibre Optic Connections And Method For Using Same

Patent ·
OSTI ID:879638
 [1];  [2];  [3];  [4];  [5];  [6];  [1];  [7]
  1. Vestal, NY
  2. Millwood, NY
  3. Richelieu, CA
  4. Rochester, NY
  5. Endwell, NY
  6. Yorktown Heights, NY
  7. Lisle, NY
+ Show Author Affiliations

A package is described that couples a twelve channel wide fiber optic cable to a twelve channel Vertical Cavity Surface Emitting Laser (VCSEL) transmitter and a multiple channel Perpendicularly Aligned Integrated Die (PAID) receiver. The package allows for reduction in the height of the assembly package by vertically orienting certain dies parallel to the fiber optic cable and horizontally orienting certain other dies. The assembly allows the vertically oriented optoelectronic dies to be perpendicularly attached to the horizontally oriented laminate via a flexible circuit.

DOE Contract Number:
B338307
Assignee:
International Business Machines Corporation (Armonk, NY)
Patent Number(s):
US 6,712,527
Application Number:
09/481903
OSTI ID:
879638
Country of Publication:
United States
Language:
English

References (13)

200-Mb/s/ch 100-m optical subsystem interconnections using 8-channel 1.3-μm laser diode arrays and single-mode fiber arrays journal January 1994
The PONI-1 parallel-optical link conference January 1999
Gigabyte/s data communications with the POLO parallel optical link
  • Hahn, K. H.; Giboney, K. S.; Wilson, R. E.
  • 1996 46th Electronic Components and Technology Conference, 1996 Proceedings 46th Electronic Components and Technology Conference https://doi.org/10.1109/ECTC.1996.517406
conference January 1996
The Jitney Parallel Optical Interconnect conference May 1996
Packaging for a 40-channel parallel optical interconnection module with an over-25-Gbit/s throughput journal January 1999
Parallel optical link (PAROLI) for multichannel gigabit rate interconnections conference January 1998
MT multifiber connectors and new applications conference January 1994
Plastic VCSEL array packaging and high density polymer waveguides for board and backplane optical interconnect conference January 1998
Packaging aspects of the Jitney parallel optical interconnect conference January 1998
OPTOBUS/sup TM/ I: a production parallel fiber optical interconnect
  • Norton, L. J.; Carney, F.; Choi, N.
  • 1997 47th Electronic Components and Technology Conference, 1997 Proceedings 47th Electronic Components and Technology Conference https://doi.org/10.1109/ECTC.1997.606170
conference January 1997
1-Gbyte/sec array transmitter and receiver modules for low-cost optical fiber interconnection
  • Nagahori, T.; Miyoshi, K.; Hatakeyama, I.
  • 1996 46th Electronic Components and Technology Conference, 1996 Proceedings 46th Electronic Components and Technology Conference https://doi.org/10.1109/ECTC.1996.517400
conference January 1996
Reliable, compact, CMOS interface, 200-Mbit/s a 12-channel optical interconnects using single-mode fiber arrays
  • Miura, A.; Tonehira, K.; Takai, A.
  • 1997 47th Electronic Components and Technology Conference, 1997 Proceedings 47th Electronic Components and Technology Conference https://doi.org/10.1109/ECTC.1997.606173
conference January 1997
3.5 Gb/s×4 ch optical interconnection module for ATM switching system
  • Tanaka, N.; Arai, Y.; Takahara, H.
  • 1997 47th Electronic Components and Technology Conference, 1997 Proceedings 47th Electronic Components and Technology Conference https://doi.org/10.1109/ECTC.1997.606171
conference January 1997

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