Modeling microscale heat transfer using Calore.
Modeling microscale heat transfer with the computational-heat-transfer code Calore is discussed. Microscale heat transfer problems differ from their macroscopic counterparts in that conductive heat transfer in both solid and gaseous materials may have important noncontinuum effects. In a solid material, three noncontinuum effects are considered: ballistic transport of phonons across a thin film, scattering of phonons from surface roughness at a gas-solid interface, and scattering of phonons from grain boundaries within the solid material. These processes are modeled for polycrystalline silicon, and the thermal-conductivity values predicted by these models are compared to experimental data. In a gaseous material, two noncontinuum effects are considered: ballistic transport of gas molecules across a thin gap and accommodation of gas molecules to solid conditions when reflecting from a solid surface. These processes are modeled for arbitrary gases by allowing the gas and solid temperatures across a gas-solid interface to differ: a finite heat transfer coefficient (contact conductance) is imposed at the gas-solid interface so that the temperature difference is proportional to the normal heat flux. In this approach, the behavior of gas in the bulk is not changed from behavior observed under macroscopic conditions. These models are implemented in Calore as user subroutines. The user subroutines reside within Sandia's Source Forge server, where they undergo version control and regression testing and are available to analysts needing these capabilities. A Calore simulation is presented that exercises these models for a heated microbeam separated from an ambient-temperature substrate by a thin gas-filled gap. Failure to use the noncontinuum heat transfer models for the solid and the gas causes the maximum temperature of the microbeam to be significantly underpredicted.
- Research Organization:
- Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 876289
- Report Number(s):
- SAND2005-5979; TRN: US0601169
- Country of Publication:
- United States
- Language:
- English
Similar Records
Conjugate heat transfer analysis using the Calore and Fuego codes.
Measured and predicted temperature profiles along MEMS bridges at pressures from 0.05 to 625 torr.