skip to main content
OSTI.GOV title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Double sided circuit board and a method for its manufacture

Abstract

Conductance between the sides of a large double sided printed circuit board is provided using a method which eliminates the need for chemical immersion or photographic exposure of the entire large board. A plurality of through-holes are drilled or punched in a substratum according to the desired pattern, conductive laminae are made to adhere to both sides of the substratum covering the holes and the laminae are pressed together and permanently joined within the holes, providing conductive paths.

Inventors:
 [1]
  1. St. Charles, IL
Publication Date:
Research Org.:
Fermi National Accelerator Laboratory (FNAL), Batavia, IL (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
875236
Patent Number(s):
H000650
Application Number:
07/182671
Assignee:
United States of America as represented by United States (Washington, DC)
DOE Contract Number:  
AC02-76CH03000
Resource Type:
Patent
Resource Relation:
Patent File Date: 1988 Apr 14
Country of Publication:
United States
Language:
English
Subject:
statutory invention registration; double; sided; circuit; board; method; manufacture; conductance; printed; provided; eliminates; chemical; immersion; photographic; exposure; entire; plurality; through-holes; drilled; punched; substratum; according; desired; pattern; conductive; laminae; adhere; covering; holes; pressed; permanently; joined; providing; paths; circuit board; printed circuit; conductive path; desired pattern; conductive paths; double sided; /174/29/

Citation Formats

Lindenmeyer, Carl W. Double sided circuit board and a method for its manufacture. United States: N. p., 1989. Web.
Lindenmeyer, Carl W. Double sided circuit board and a method for its manufacture. United States.
Lindenmeyer, Carl W. 1989. "Double sided circuit board and a method for its manufacture". United States. https://www.osti.gov/servlets/purl/875236.
@article{osti_875236,
title = {Double sided circuit board and a method for its manufacture},
author = {Lindenmeyer, Carl W.},
abstractNote = {Conductance between the sides of a large double sided printed circuit board is provided using a method which eliminates the need for chemical immersion or photographic exposure of the entire large board. A plurality of through-holes are drilled or punched in a substratum according to the desired pattern, conductive laminae are made to adhere to both sides of the substratum covering the holes and the laminae are pressed together and permanently joined within the holes, providing conductive paths.},
doi = {},
url = {https://www.osti.gov/biblio/875236}, journal = {},
number = ,
volume = ,
place = {United States},
year = {Sun Jan 01 00:00:00 EST 1989},
month = {Sun Jan 01 00:00:00 EST 1989}
}