Bi-level multilayered microelectronic device package with an integral window
- Albuquerque, NM
- Tijeras, NM
A bi-level, multilayered package with an integral window for housing a microelectronic device. The device can be a semiconductor chip, a CCD chip, a CMOS chip, a VCSEL chip, a laser diode, a MEMS device, or a IMEMS device. The multilayered package can be formed of a low-temperature cofired ceramic (LTCC) or high-temperature cofired ceramic (HTCC) multilayer processes with the window being simultaneously joined (e.g. cofired) to the package body during LTCC or HTCC processing. The microelectronic device can be flip-chip bonded and oriented so that the light-sensitive side is optically accessible through the window. A second chip can be bonded to the backside of the first chip, with the second chip being wirebonded to the second level of the bi-level package. The result is a compact, low-profile package, having an integral window that can be hermetically-sealed.
- Research Organization:
- Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
- DOE Contract Number:
- AC04-94AL85000
- Assignee:
- Sandia Corporation (Albuquerque, NM)
- Patent Number(s):
- US 6495895
- OSTI ID:
- 874949
- Country of Publication:
- United States
- Language:
- English
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Microelectronic device package with an integral window
Bi-level microelectronic device package with an integral window
Related Subjects
multilayered
microelectronic
device
package
integral
window
housing
semiconductor
chip
ccd
cmos
vcsel
laser
diode
mems
imems
formed
low-temperature
cofired
ceramic
ltcc
high-temperature
htcc
multilayer
processes
simultaneously
joined
processing
flip-chip
bonded
oriented
light-sensitive
optically
accessible
backside
wirebonded
level
result
compact
low-profile
hermetically-sealed
laser diode
mems device
semiconductor chip
electronic device
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