Sealed symmetric multilayered microelectronic device package with integral windows
- Albuquerque, NM
- Tijeras, NM
A sealed symmetric multilayered package with integral windows for housing one or more microelectronic devices. The devices can be a semiconductor chip, a CCD chip, a CMOS chip, a VCSEL chip, a laser diode, a MEMS device, or a IMEMS device. The multilayered package can be formed of a low-temperature cofired ceramic (LTCC) or high-temperature cofired ceramic (HTCC) multilayer processes with the windows being simultaneously joined (e.g. cofired) to the package body during LTCC or HTCC processing. The microelectronic devices can be flip-chip bonded and oriented so that the light-sensitive sides are optically accessible through the windows. The result is a compact, low-profile, sealed symmetric package, having integral windows that can be hermetically-sealed.
- Research Organization:
- Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
- DOE Contract Number:
- AC04-94AL85000
- Assignee:
- Sandia Corporation (Albuquerque, NM)
- Patent Number(s):
- US 6489670
- OSTI ID:
- 874922
- Country of Publication:
- United States
- Language:
- English
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Related Subjects
symmetric
multilayered
microelectronic
device
package
integral
windows
housing
devices
semiconductor
chip
ccd
cmos
vcsel
laser
diode
mems
imems
formed
low-temperature
cofired
ceramic
ltcc
high-temperature
htcc
multilayer
processes
simultaneously
joined
processing
flip-chip
bonded
oriented
light-sensitive
optically
accessible
result
compact
low-profile
hermetically-sealed
laser diode
mems device
semiconductor chip
electronic device
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