Method for making MgO buffer layers on rolled nickel or copper as superconductor substrates
Patent
·
OSTI ID:874823
- Knoxville, TN
Buffer layer architectures are epitaxially deposited on biaxially-textured rolled-Ni and/or Cu substrates for high current conductors, and more particularly buffer layer architectures such as MgO/Ag/Pt/Ni, MgO/Ag/Pd/Ni, MgO/Ag/Ni, MgO/Ag/Pd/Cu, MgO/Ag/Pt/Cu, and MgO/Ag/Cu. Techniques used to deposit these buffer layers include electron beam evaporation, thermal evaporation, rf magnetron sputtering, pulsed laser deposition, metal-organic chemical vapor deposition (MOCVD), combustion CVD, and spray pyrolysis.
- Research Organization:
- LOCKHEED MARTIN ENERGY RES COR
- DOE Contract Number:
- AC05-96OR22464
- Assignee:
- UT-Battelle, LLC ()
- Patent Number(s):
- US 6468591
- OSTI ID:
- 874823
- Country of Publication:
- United States
- Language:
- English
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journal | February 1997 |
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|
journal | June 1992 |
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vapor
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andor
architectures
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biaxially-textured
biaxially-textured rolled
buffer
buffer layer
chemical
chemical vapor
combustion
conductors
copper
current
current conductor
cvd
deposit
deposited
deposition
electron
electron beam
epitaxially
evaporation
laser
laser deposition
layer
layer architectures
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magnetron
metal-organic
method
mgo
mgoagcu
mgoagni
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mgoagpdni
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mgoagptni
mocvd
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pulsed laser
pyrolysis
rf
rolled
rolled-ni
spray
sputtering
substrates
superconductor
superconductor substrates
techniques
thermal
vapor
vapor deposition