Extreme-UV lithography vacuum chamber zone seal

Patent · 31 December 2000

OSTI ID:874189

Haney, Steven J ^[1]; Herron, Donald Joe ^[2]; Klebanoff, Leonard E ^[3]; Replogle, William C ^[4]

---

1. Tracy, CA
2. Manteca, CA
3. San Ramon, CA
4. Livermore, CA

Control of particle contamination on the reticle and carbon contamination of optical surfaces in photolithography systems can be achieved by the establishment of multiple pressure zones in the photolithography systems. The different zones will enclose the reticle, projection optics, wafer, and other components of system. The system includes a vacuum apparatus that includes: a housing defining a vacuum chamber; one or more metrology trays situated within the vacuum chamber each of which is supported by at least one support member, wherein the tray separates the vacuum chamber into a various compartments that are maintained at different pressures; and conductance seal devices for adjoining the perimeter of each tray to an inner surface of the housing wherein the tray is decoupled from vibrations emanating from the inner surface of the housing.

• Research Organization: SANDIA CORP
• DOE Contract Number: AC04-94AL85000
• Assignee: EUV LLC (Santa Clara, CA)
• Patent Number(s): US 6333775
• OSTI ID: 874189
• Country of Publication: United States
• Language: English

Related Subjects

/355/277/
achieved
adjoining
apparatus
carbon
carbon contamination
chamber
compartments
components
conductance
contamination
control
decoupled
defining
devices
emanating
enclose
establishment
extreme-uv
extreme-uv lithography
housing
inner
lithography
lithography systems
maintained
metrology
multiple
optical
optical surface
optics
particle
perimeter
photolithography
pressure
pressures
projection
reticle
seal
separates
situated
support
supported
surface
surfaces
systems
tray
trays
vacuum
vacuum chamber
vibrations
wafer
zone
zones