Wafer scale micromachine assembly method

Patent · Mon Jan 01 00:00:00 EST 2001

OSTI ID:874181

Christenson, Todd R ^[1]

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1. Albuquerque, NM

A method for fusing together, using diffusion bonding, micromachine subassemblies which are separately fabricated is described. A first and second micromachine subassembly are fabricated on a first and second substrate, respectively. The substrates are positioned so that the upper surfaces of the two micromachine subassemblies face each other and are aligned so that the desired assembly results from their fusion. The upper surfaces are then brought into contact, and the assembly is subjected to conditions suited to the desired diffusion bonding.

• Research Organization: Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
• DOE Contract Number: AC04-94AL85000
• Assignee: Sandia Corporation (Albuquerque, NM)
• Patent Number(s): US 6332568
• OSTI ID: 874181
• Country of Publication: United States
• Language: English

Related Subjects

wafer
scale
micromachine
assembly
method
fusing
diffusion
bonding
subassemblies
separately
fabricated
described
subassembly
substrate
substrates
positioned
upper
surfaces
aligned
results
fusion
brought
contact
subjected
conditions
suited
upper surface
diffusion bonding
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