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Title: Method using photo-induced and thermal bending of MEMS sensors

Abstract

A method for measuring chemical analytes and physical forces by measuring changes in the deflection of a microelectromechanical cantilever structure while it is being irradiated by a light having an energy above the band gap of the structure.

Inventors:
 [1]
  1. (Knoxville, TN)
Publication Date:
Research Org.:
LOCKHEED MARTIN ENERGY RES COR
OSTI Identifier:
874104
Patent Number(s):
US 6312959
Assignee:
U.T. Battelle, LLC (Oak Ridge, TN) ORNL
DOE Contract Number:  
AC05-96OR22464
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
method; photo-induced; thermal; bending; mems; sensors; measuring; chemical; analytes; physical; forces; changes; deflection; microelectromechanical; cantilever; structure; irradiated; light; energy; band; gap; band gap; measuring changes; /436/

Citation Formats

Datskos, Panagiotis G. Method using photo-induced and thermal bending of MEMS sensors. United States: N. p., 2001. Web.
Datskos, Panagiotis G. Method using photo-induced and thermal bending of MEMS sensors. United States.
Datskos, Panagiotis G. Mon . "Method using photo-induced and thermal bending of MEMS sensors". United States. https://www.osti.gov/servlets/purl/874104.
@article{osti_874104,
title = {Method using photo-induced and thermal bending of MEMS sensors},
author = {Datskos, Panagiotis G.},
abstractNote = {A method for measuring chemical analytes and physical forces by measuring changes in the deflection of a microelectromechanical cantilever structure while it is being irradiated by a light having an energy above the band gap of the structure.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2001},
month = {1}
}

Patent:

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