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Title: Method of making thermally removable polymeric encapsulants

Abstract

A method of making a thermally-removable encapsulant by heating a mixture of at least one bis(maleimide) compound and at least one monomeric tris(furan) or tetrakis(furan) compound at temperatures from above room temperature to less than approximately 90.degree. C. to form a gel and cooling the gel to form the thermally-removable encapsulant. The encapsulant can be easily removed within approximately an hour by heating to temperatures greater than approximately 90.degree. C., preferably in a polar solvent. The encapsulant can be used in protecting electronic components that may require subsequent removal of the encapsulant for component repair, modification or quality control.

Inventors:
 [1];  [2];  [2];  [2];  [3]
  1. Santa Fe, NM
  2. Albuquerque, NM
  3. late of Albuquerque, NM
Publication Date:
Research Org.:
Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
OSTI Identifier:
873916
Patent Number(s):
US 6271335
Assignee:
Sandia Corporation (Albuquerque, NM)
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
method; thermally; removable; polymeric; encapsulants; thermally-removable; encapsulant; heating; mixture; bis; maleimide; compound; monomeric; tris; furan; tetrakis; temperatures; temperature; approximately; 90; degree; form; cooling; easily; removed; hour; preferably; polar; solvent; protecting; electronic; components; require; subsequent; removal; component; repair; modification; quality; control; polar solvent; easily removed; electronic components; subsequent removal; /528/264/525/

Citation Formats

Small, James H, Loy, Douglas A, Wheeler, David R, McElhanon, James R, and Saunders, Randall S. Method of making thermally removable polymeric encapsulants. United States: N. p., 2001. Web.
Small, James H, Loy, Douglas A, Wheeler, David R, McElhanon, James R, & Saunders, Randall S. Method of making thermally removable polymeric encapsulants. United States.
Small, James H, Loy, Douglas A, Wheeler, David R, McElhanon, James R, and Saunders, Randall S. 2001. "Method of making thermally removable polymeric encapsulants". United States. https://www.osti.gov/servlets/purl/873916.
@article{osti_873916,
title = {Method of making thermally removable polymeric encapsulants},
author = {Small, James H and Loy, Douglas A and Wheeler, David R and McElhanon, James R and Saunders, Randall S},
abstractNote = {A method of making a thermally-removable encapsulant by heating a mixture of at least one bis(maleimide) compound and at least one monomeric tris(furan) or tetrakis(furan) compound at temperatures from above room temperature to less than approximately 90.degree. C. to form a gel and cooling the gel to form the thermally-removable encapsulant. The encapsulant can be easily removed within approximately an hour by heating to temperatures greater than approximately 90.degree. C., preferably in a polar solvent. The encapsulant can be used in protecting electronic components that may require subsequent removal of the encapsulant for component repair, modification or quality control.},
doi = {},
url = {https://www.osti.gov/biblio/873916}, journal = {},
number = ,
volume = ,
place = {United States},
year = {2001},
month = {1}
}

Works referenced in this record:

The application of the Diels-Alder reaction to polymers bearing furan moieties. 1. Reactions with maleimides
journal, August 1997