Method of making thermally removable polymeric encapsulants

Patent · 31 December 2000

OSTI ID:873916

Small, James H ^[1]; Loy, Douglas A ^[2]; Wheeler, David R ^[2]; McElhanon, James R ^[2]; Saunders, Randall S ^[3]

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1. Santa Fe, NM
2. Albuquerque, NM
3. late of Albuquerque, NM

A method of making a thermally-removable encapsulant by heating a mixture of at least one bis(maleimide) compound and at least one monomeric tris(furan) or tetrakis(furan) compound at temperatures from above room temperature to less than approximately 90.degree. C. to form a gel and cooling the gel to form the thermally-removable encapsulant. The encapsulant can be easily removed within approximately an hour by heating to temperatures greater than approximately 90.degree. C., preferably in a polar solvent. The encapsulant can be used in protecting electronic components that may require subsequent removal of the encapsulant for component repair, modification or quality control.

• Research Organization: SANDIA CORP
• DOE Contract Number: AC04-94AL85000
• Assignee: Sandia Corporation (Albuquerque, NM)
• Patent Number(s): US 6271335
• OSTI ID: 873916
• Country of Publication: United States
• Language: English

Related Subjects

/528/264/525/
90
approximately
bis
component
components
compound
control
cooling
degree
easily
easily removed
electronic
electronic components
encapsulant
encapsulants
form
furan
heating
hour
maleimide
method
mixture
modification
monomeric
polar
polar solvent
polymeric
preferably
protecting
quality
removable
removal
removed
repair
require
solvent
subsequent
subsequent removal
temperature
temperatures
tetrakis
thermally
thermally-removable
tris