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Title: Process for fabricating composite material having high thermal conductivity

Abstract

A process for fabricating a composite material such as that having high thermal conductivity and having specific application as a heat sink or heat spreader for high density integrated circuits. The composite material produced by this process has a thermal conductivity between that of diamond and copper, and basically consists of coated diamond particles dispersed in a high conductivity metal, such as copper. The composite material can be fabricated in small or relatively large sizes using inexpensive materials. The process basically consists, for example, of sputter coating diamond powder with several elements, including a carbide forming element and a brazeable material, compacting them into a porous body, and infiltrating the porous body with a suitable braze material, such as copper-silver alloy, thereby producing a dense diamond-copper composite material with a thermal conductivity comparable to synthetic diamond films at a fraction of the cost.

Inventors:
 [1];  [2];  [1];  [1]
  1. (Livermore, CA)
  2. (San Carlos, CA)
Publication Date:
Research Org.:
Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
OSTI Identifier:
873880
Patent Number(s):
US 6264882
Assignee:
Regents of University of California (Oakland, CA) LLNL
DOE Contract Number:  
W-7405-ENG-48
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
process; fabricating; composite; material; thermal; conductivity; specific; application; heat; sink; spreader; density; integrated; circuits; produced; diamond; copper; basically; consists; coated; particles; dispersed; metal; fabricated; relatively; sizes; inexpensive; materials; example; sputter; coating; powder; elements; including; carbide; forming; element; brazeable; compacting; porous; infiltrating; suitable; braze; copper-silver; alloy; producing; dense; diamond-copper; comparable; synthetic; films; fraction; cost; material produced; diamond particles; basically consists; conductivity metal; synthetic diamond; braze material; heat sink; thermal conductivity; integrated circuits; composite material; integrated circuit; diamond film; specific application; sputter coating; diamond films; particles dispersed; suitable braze; carbide forming; silver alloy; composite mat; copper-silver alloy; diamond powder; forming element; inexpensive materials; heat spreader; fabricating composite; /264/419/427/

Citation Formats

Colella, Nicholas J., Davidson, Howard L., Kerns, John A., and Makowiecki, Daniel M. Process for fabricating composite material having high thermal conductivity. United States: N. p., 2001. Web.
Colella, Nicholas J., Davidson, Howard L., Kerns, John A., & Makowiecki, Daniel M. Process for fabricating composite material having high thermal conductivity. United States.
Colella, Nicholas J., Davidson, Howard L., Kerns, John A., and Makowiecki, Daniel M. Mon . "Process for fabricating composite material having high thermal conductivity". United States. doi:. https://www.osti.gov/servlets/purl/873880.
@article{osti_873880,
title = {Process for fabricating composite material having high thermal conductivity},
author = {Colella, Nicholas J. and Davidson, Howard L. and Kerns, John A. and Makowiecki, Daniel M.},
abstractNote = {A process for fabricating a composite material such as that having high thermal conductivity and having specific application as a heat sink or heat spreader for high density integrated circuits. The composite material produced by this process has a thermal conductivity between that of diamond and copper, and basically consists of coated diamond particles dispersed in a high conductivity metal, such as copper. The composite material can be fabricated in small or relatively large sizes using inexpensive materials. The process basically consists, for example, of sputter coating diamond powder with several elements, including a carbide forming element and a brazeable material, compacting them into a porous body, and infiltrating the porous body with a suitable braze material, such as copper-silver alloy, thereby producing a dense diamond-copper composite material with a thermal conductivity comparable to synthetic diamond films at a fraction of the cost.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Mon Jan 01 00:00:00 EST 2001},
month = {Mon Jan 01 00:00:00 EST 2001}
}

Patent:

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