skip to main content
OSTI.GOV title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Process for protecting bonded components from plating shorts

Abstract

A method which protects the region between a component and the substrate onto which the components is bonded using an electrically insulating fillet of photoresist. The fillet protects the regions from subsequent plating with metal and therefore shorting the plated conductors which run down the sides of the component and onto the substrate.

Inventors:
 [1];  [2];  [3];  [2];  [4]
  1. Livermore, CA
  2. Pleasanton, CA
  3. Mountain View, CA
  4. Menlo Park, CA
Publication Date:
Research Org.:
Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
OSTI Identifier:
872957
Patent Number(s):
US 6051493
Assignee:
Regents of University of California (Oakland, CA)
DOE Contract Number:  
W-7405-ENG-48
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
process; protecting; bonded; components; plating; shorts; method; protects; region; component; substrate; electrically; insulating; fillet; photoresist; regions; subsequent; metal; shorting; plated; conductors; run; electrically insulating; /438/205/

Citation Formats

Tarte, Lisa A, Bonde, Wayne L, Carey, Paul G, Contolini, Robert J, and McCarthy, Anthony M. Process for protecting bonded components from plating shorts. United States: N. p., 2000. Web.
Tarte, Lisa A, Bonde, Wayne L, Carey, Paul G, Contolini, Robert J, & McCarthy, Anthony M. Process for protecting bonded components from plating shorts. United States.
Tarte, Lisa A, Bonde, Wayne L, Carey, Paul G, Contolini, Robert J, and McCarthy, Anthony M. Sat . "Process for protecting bonded components from plating shorts". United States. https://www.osti.gov/servlets/purl/872957.
@article{osti_872957,
title = {Process for protecting bonded components from plating shorts},
author = {Tarte, Lisa A and Bonde, Wayne L and Carey, Paul G and Contolini, Robert J and McCarthy, Anthony M},
abstractNote = {A method which protects the region between a component and the substrate onto which the components is bonded using an electrically insulating fillet of photoresist. The fillet protects the regions from subsequent plating with metal and therefore shorting the plated conductors which run down the sides of the component and onto the substrate.},
doi = {},
url = {https://www.osti.gov/biblio/872957}, journal = {},
number = ,
volume = ,
place = {United States},
year = {2000},
month = {1}
}

Patent:

Save / Share:

Works referenced in this record:

Multichip packaging for very-high-speed digital systems
journal, December 1990