Process for metallization of a substrate by irradiative curing of a catalyst applied thereto

Patent · Fri Jan 01 00:00:00 EST 1999

OSTI ID:872686

Chen, Ken S ^[1]; Morgan, William P ^[1]; Zich, John L ^[1]

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1. Albuquerque, NM

An improved additive process for metallization of substrates is described whereby a catalyst solution is applied to a surface of a substrate. Metallic catalytic clusters can be formed in the catalyst solution on the substrate surface by irradiating the substrate. Electroless plating can then deposit metal onto the portion of the substrate surface having metallic clusters. Additional metallization thickness can be obtained by electrolytically plating the substrate surface after the electroless plating step.

• Research Organization: Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
• DOE Contract Number: AC04-94AL85000
• Assignee: Sandia Corporation (Albuquerque, NM)
• Patent Number(s): US 5989653
• OSTI ID: 872686
• Country of Publication: United States
• Language: English

Related Subjects

process
metallization
substrate
irradiative
curing
catalyst
applied
thereto
improved
additive
substrates
described
whereby
solution
surface
metallic
catalytic
clusters
formed
irradiating
electroless
plating
deposit
metal
portion
additional
thickness
obtained
electrolytically
step
additional metal
additive process
electroless plating
applied thereto
substrate surface
catalyst solution
bed whereby
described whereby
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