Automated defect spatial signature analysis for semiconductor manufacturing process

Patent · 31 December 1998

OSTI ID:872659

Gleason, Shaun S ^[1]; Karnowski, Thomas P ^[1]; Sari-Sarraf, Hamed ^[1]

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1. Knoxville, TN

An apparatus and method for performing automated defect spatial signature alysis on a data set representing defect coordinates and wafer processing information includes categorizing data from the data set into a plurality of high level categories, classifying the categorized data contained in each high level category into user-labeled signature events, and correlating the categorized, classified signature events to a present or incipient anomalous process condition.

• Research Organization: LOCKHEED MARTIN ENRGY SYST INC
• DOE Contract Number: AC05-84OR21400
• Assignee: Lockheed Martin Energy Research Corp. Oak Ridge National Laboratory (Oak Ridge, TN)
• Patent Number(s): US 5982920
• OSTI ID: 872659
• Country of Publication: United States
• Language: English

Related Subjects

/382/
alysis
analysis
anomalous
apparatus
automated
automated defect
categories
categorized
categorizing
category
classified
classifying
condition
contained
coordinates
correlating
data
data contain
data set
defect
defect spatial
events
incipient
information
level
manufacturing
manufacturing process
method
performing
performing automated
plurality
process
processing
representing
semiconductor
semiconductor manufacturing
set
signature
signature analysis
spatial
spatial signature
user-labeled
wafer