High thermal expansion sealing glass for use in radio frequency applications

Patent · Fri Jan 01 00:00:00 EST 1999

OSTI ID:872578

Kilgo, Riley D ^[1]; Brow, Richard K ^[2]; Kovacic, Larry ^[1]

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1. Albuquerque, NM
2. Rolla, MO

The present invention provides a glass composition for hermetically sealing to high thermal expansion materials such as aluminum alloys, stainless steels, and copper alloys, which includes between about 10 and about 25 mole percent Na.sub.2 O, between about 10 and about 25 mole percent K.sub.2 O, between about 4 and about 15 mole percent Al.sub.2 O.sub.3, between about 35 and about 50 mole percent P.sub.2 O.sub.5, B.sub.2 O.sub.3 in a concentration not exceeding 10 mole percent, and MXO in a concentration not exceeding 12 mole percent, wherein MXO is a metal oxide selected from the group consisting of PbO, BaO, CaO and MgO or a mixture thereof. This composition is suitable to hermetically seal to components for use in RF-interconnection applications.

• Research Organization: Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
• DOE Contract Number: AC04-94AL85000
• Assignee: Sandia Corporation (Albuquerque, NM)
• Patent Number(s): US 5965469
• OSTI ID: 872578
• Country of Publication: United States
• Language: English

Related Subjects

thermal
expansion
sealing
glass
radio
frequency
applications
provides
composition
hermetically
materials
aluminum
alloys
stainless
steels
copper
10
25
mole
percent
na
15
35
50
concentration
exceeding
mxo
12
metal
oxide
selected
consisting
pbo
bao
cao
mgo
mixture
suitable
seal
components
rf-interconnection
hermetically sealing
stainless steels
radio frequency
thermal expansion
metal oxide
stainless steel
mole percent
glass composition
aluminum alloy
copper alloy
oxide selected
aluminum alloys
sealing glass
expansion sealing
percent na
frequency applications
copper alloys
hermetically seal
expansion materials
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