Methods of fabricating applique circuits

Patent · Tue Sep 14 00:00:00 EDT 1999

OSTI ID:872509

Dimos, Duane B ^[1]; Garino, Terry J ^[1]

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1. Albuquerque, NM

Applique circuits suitable for advanced packaging applications are introduced. These structures are particularly suited for the simple integration of large amounts (many nanoFarads) of capacitance into conventional integrated circuit and multichip packaging technology. In operation, applique circuits are bonded to the integrated circuit or other appropriate structure at the point where the capacitance is required, thereby minimizing the effects of parasitic coupling. An immediate application is to problems of noise reduction and control in modern high-frequency circuitry.

• Research Organization: Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
• DOE Contract Number: AC04-94DP85000
• Assignee: Sandia Corporation (Albuquerque, NM)
• Patent Number(s): US 5950292
• Application Number: 08/811,305
• OSTI ID: 872509
• Country of Publication: United States
• Language: English

Related Subjects

methods
fabricating
applique
circuits
suitable
advanced
packaging
applications
introduced
structures
particularly
suited
simple
integration
amounts
nanofarads
capacitance
conventional
integrated
circuit
multichip
technology
operation
bonded
appropriate
structure
required
minimizing
effects
parasitic
coupling
immediate
application
noise
reduction
control
modern
high-frequency
circuitry
particularly suited
integrated circuit
applique circuits
noise reduction
frequency circuit
/29/216/427/