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Title: Low temperature joining of ceramic composites

Patent ·
OSTI ID:872090

A method of joining similar or dissimilar ceramic and ceramic composite materials, such as SiC continuous fiber ceramic composites, at relatively low joining temperatures uses a solventless, three component bonding agent effective to promote mechanical bond toughness and elevated temperature strength to operating temperatures of approximately 1200 degrees C. The bonding agent comprises a preceramic precursor, an aluminum bearing powder, such as aluminum alloy powder, and mixtures of aluminum metal or alloy powders with another powder, and and boron powder in selected proportions. The bonding agent is disposed as an interlayer between similar or dissimilar ceramic or cermaic composite materials to be joined and is heated in ambient air or inert atmosphere to a temperature not exceeding about 1200 degrees C. to form a strong and tough bond joint between the materials. The bond joint produced is characterized by a composite joint microstructure having relatively soft, compliant aluminum bearing particulate regions dispersed in a ceramic matrix.

Research Organization:
Ames Laboratory (AMES), Ames, IA; Iowa State Univ., Ames, IA (United States)
DOE Contract Number:
W-7405-ENG-82
Assignee:
Iowa State University Research Foundation, Inc. (Ames, IA)
Patent Number(s):
US 5858144
Application Number:
08/631,259
OSTI ID:
872090
Country of Publication:
United States
Language:
English

References (10)

Ti3SiC2 phase in SiC/SiC joint brazed with Cu43T57 alloy journal December 1990
Joining of Silicon Carbide/Silicon Carbide Composites and Dense Silicon Carbide Using Combustion Reactions in the Titanium-Carbon-Nickel System journal January 1992
Creep behaviour and structural characterization at high temperatures of Nicalon SiC fibres journal November 1984
Thermal stability of SiC fibres (Nicalon�) journal April 1984
Bonding mechanism between silicon carbide and thin foils of reactive metals journal November 1985
Feasibility Study of the Welding of Sic journal June 1985
Brazing of pressureless-sintered SiC using Ag-Cu-Ti alloy journal July 1987
Effects of Joining Pressure and Deformation on the Strength and Microstructure of Diffusion-Bonded Silicon Carbide journal March 1992
Joining of Self-Bonded Silicon Carbide by Germanium Metal journal January 1981
Joining of dense silicon carbide by hot-pressing journal April 1980

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