Load regulating expansion fixture
Patent
·
OSTI ID:872037
- San Jose, CA
A free standing self contained device for bonding ultra thin metallic films, such as 0.001 inch beryllium foils. The device will regulate to a predetermined load for solid state bonding when heated to a bonding temperature. The device includes a load regulating feature, whereby the expansion stresses generated for bonding are regulated and self adjusting. The load regulator comprises a pair of friction isolators with a plurality of annealed copper members located therebetween. The device, with the load regulator, will adjust to and maintain a stress level needed to successfully and economically complete a leak tight bond without damaging thin foils or other delicate components.
- Research Organization:
- Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)
- DOE Contract Number:
- W-7405-ENG-48
- Assignee:
- Regents of University of California (Oakland, CA)
- Patent Number(s):
- US 5848746
- OSTI ID:
- 872037
- Country of Publication:
- United States
- Language:
- English
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Related Subjects
load
regulating
expansion
fixture
free
standing
contained
device
bonding
ultra
metallic
films
001
inch
beryllium
foils
regulate
predetermined
solid
heated
temperature
feature
whereby
stresses
generated
regulated
adjusting
regulator
comprises
pair
friction
isolators
plurality
annealed
copper
located
therebetween
adjust
maintain
stress
level
successfully
economically
complete
leak
tight
bond
damaging
delicate
components
free standing
stresses generated
bonding temperature
annealed copper
leak tight
located therebetween
stress level
metallic film
expansion stresses
/228/
regulating
expansion
fixture
free
standing
contained
device
bonding
ultra
metallic
films
001
inch
beryllium
foils
regulate
predetermined
solid
heated
temperature
feature
whereby
stresses
generated
regulated
adjusting
regulator
comprises
pair
friction
isolators
plurality
annealed
copper
located
therebetween
adjust
maintain
stress
level
successfully
economically
complete
leak
tight
bond
damaging
delicate
components
free standing
stresses generated
bonding temperature
annealed copper
leak tight
located therebetween
stress level
metallic film
expansion stresses
/228/