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Title: Process system and method for fabricating submicron field emission cathodes

Abstract

A process method and system for making field emission cathodes exists. The deposition source divergence is controlled to produce field emission cathodes with height-to-base aspect ratios that are uniform over large substrate surface areas while using very short source-to-substrate distances. The rate of hole closure is controlled from the cone source. The substrate surface is coated in well defined increments. The deposition source is apertured to coat pixel areas on the substrate. The entire substrate is coated using a manipulator to incrementally move the whole substrate surface past the deposition source. Either collimated sputtering or evaporative deposition sources can be used. The position of the aperture and its size and shape are used to control the field emission cathode size and shape.

Inventors:
 [1];  [2]
  1. Livermore, CA
  2. Ripon, CA
Publication Date:
Research Org.:
Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)
OSTI Identifier:
871518
Patent Number(s):
US 5746634
Assignee:
Regents of University of California (Oakland, CA)
DOE Contract Number:  
W-7405-ENG-48
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
process; method; fabricating; submicron; field; emission; cathodes; exists; deposition; source; divergence; controlled; produce; height-to-base; aspect; ratios; uniform; substrate; surface; source-to-substrate; distances; rate; closure; cone; coated; defined; increments; apertured; coat; pixel; entire; manipulator; incrementally; move; past; collimated; sputtering; evaporative; sources; position; aperture; size; shape; control; cathode; aspect ratio; field emission; substrate surface; aspect ratios; process method; emission cathode; emission cathodes; entire substrate; /445/118/427/

Citation Formats

Jankowski, Alan F, and Hayes, Jeffrey P. Process system and method for fabricating submicron field emission cathodes. United States: N. p., 1998. Web.
Jankowski, Alan F, & Hayes, Jeffrey P. Process system and method for fabricating submicron field emission cathodes. United States.
Jankowski, Alan F, and Hayes, Jeffrey P. 1998. "Process system and method for fabricating submicron field emission cathodes". United States. https://www.osti.gov/servlets/purl/871518.
@article{osti_871518,
title = {Process system and method for fabricating submicron field emission cathodes},
author = {Jankowski, Alan F and Hayes, Jeffrey P},
abstractNote = {A process method and system for making field emission cathodes exists. The deposition source divergence is controlled to produce field emission cathodes with height-to-base aspect ratios that are uniform over large substrate surface areas while using very short source-to-substrate distances. The rate of hole closure is controlled from the cone source. The substrate surface is coated in well defined increments. The deposition source is apertured to coat pixel areas on the substrate. The entire substrate is coated using a manipulator to incrementally move the whole substrate surface past the deposition source. Either collimated sputtering or evaporative deposition sources can be used. The position of the aperture and its size and shape are used to control the field emission cathode size and shape.},
doi = {},
url = {https://www.osti.gov/biblio/871518}, journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue May 05 00:00:00 EDT 1998},
month = {Tue May 05 00:00:00 EDT 1998}
}

Works referenced in this record:

Metal ion deposition from ionized mangetron sputtering discharge
journal, January 1994


A Thin‐Film Field‐Emission Cathode
journal, June 1968


Field-emitter arrays for vacuum microelectronics
journal, January 1991


Collimated sputter deposition, a novel method for large area deposition of Spindt type field emission tips
journal, March 1995


Physical properties of thin‐film field emission cathodes with molybdenum cones
journal, December 1976


Arrays of gated field-emitter cones having 0.32 μm tip-to-tip spacing
journal, March 1994