Process system and method for fabricating submicron field emission cathodes
Abstract
A process method and system for making field emission cathodes exists. The deposition source divergence is controlled to produce field emission cathodes with height-to-base aspect ratios that are uniform over large substrate surface areas while using very short source-to-substrate distances. The rate of hole closure is controlled from the cone source. The substrate surface is coated in well defined increments. The deposition source is apertured to coat pixel areas on the substrate. The entire substrate is coated using a manipulator to incrementally move the whole substrate surface past the deposition source. Either collimated sputtering or evaporative deposition sources can be used. The position of the aperture and its size and shape are used to control the field emission cathode size and shape.
- Inventors:
-
- Livermore, CA
- Ripon, CA
- Publication Date:
- Research Org.:
- Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)
- OSTI Identifier:
- 871518
- Patent Number(s):
- US 5746634
- Assignee:
- Regents of University of California (Oakland, CA)
- DOE Contract Number:
- W-7405-ENG-48
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- process; method; fabricating; submicron; field; emission; cathodes; exists; deposition; source; divergence; controlled; produce; height-to-base; aspect; ratios; uniform; substrate; surface; source-to-substrate; distances; rate; closure; cone; coated; defined; increments; apertured; coat; pixel; entire; manipulator; incrementally; move; past; collimated; sputtering; evaporative; sources; position; aperture; size; shape; control; cathode; aspect ratio; field emission; substrate surface; aspect ratios; process method; emission cathode; emission cathodes; entire substrate; /445/118/427/
Citation Formats
Jankowski, Alan F, and Hayes, Jeffrey P. Process system and method for fabricating submicron field emission cathodes. United States: N. p., 1998.
Web.
Jankowski, Alan F, & Hayes, Jeffrey P. Process system and method for fabricating submicron field emission cathodes. United States.
Jankowski, Alan F, and Hayes, Jeffrey P. 1998.
"Process system and method for fabricating submicron field emission cathodes". United States. https://www.osti.gov/servlets/purl/871518.
@article{osti_871518,
title = {Process system and method for fabricating submicron field emission cathodes},
author = {Jankowski, Alan F and Hayes, Jeffrey P},
abstractNote = {A process method and system for making field emission cathodes exists. The deposition source divergence is controlled to produce field emission cathodes with height-to-base aspect ratios that are uniform over large substrate surface areas while using very short source-to-substrate distances. The rate of hole closure is controlled from the cone source. The substrate surface is coated in well defined increments. The deposition source is apertured to coat pixel areas on the substrate. The entire substrate is coated using a manipulator to incrementally move the whole substrate surface past the deposition source. Either collimated sputtering or evaporative deposition sources can be used. The position of the aperture and its size and shape are used to control the field emission cathode size and shape.},
doi = {},
url = {https://www.osti.gov/biblio/871518},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue May 05 00:00:00 EDT 1998},
month = {Tue May 05 00:00:00 EDT 1998}
}
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