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Title: Process system and method for fabricating submicron field emission cathodes

Abstract

A process method and system for making field emission cathodes exists. The deposition source divergence is controlled to produce field emission cathodes with height-to-base aspect ratios that are uniform over large substrate surface areas while using very short source-to-substrate distances. The rate of hole closure is controlled from the cone source. The substrate surface is coated in well defined increments. The deposition source is apertured to coat pixel areas on the substrate. The entire substrate is coated using a manipulator to incrementally move the whole substrate surface past the deposition source. Either collimated sputtering or evaporative deposition sources can be used. The position of the aperture and its size and shape are used to control the field emission cathode size and shape.

Inventors:
 [1];  [2]
  1. (Livermore, CA)
  2. (Ripon, CA)
Publication Date:
Research Org.:
Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
OSTI Identifier:
871518
Patent Number(s):
US 5746634
Assignee:
Regents of University of California (Oakland, CA) LLNL
DOE Contract Number:  
W-7405-ENG-48
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
process; method; fabricating; submicron; field; emission; cathodes; exists; deposition; source; divergence; controlled; produce; height-to-base; aspect; ratios; uniform; substrate; surface; source-to-substrate; distances; rate; closure; cone; coated; defined; increments; apertured; coat; pixel; entire; manipulator; incrementally; move; past; collimated; sputtering; evaporative; sources; position; aperture; size; shape; control; cathode; aspect ratio; field emission; substrate surface; aspect ratios; process method; emission cathode; emission cathodes; entire substrate; /445/118/427/

Citation Formats

Jankowski, Alan F., and Hayes, Jeffrey P. Process system and method for fabricating submicron field emission cathodes. United States: N. p., 1998. Web.
Jankowski, Alan F., & Hayes, Jeffrey P. Process system and method for fabricating submicron field emission cathodes. United States.
Jankowski, Alan F., and Hayes, Jeffrey P. Thu . "Process system and method for fabricating submicron field emission cathodes". United States. https://www.osti.gov/servlets/purl/871518.
@article{osti_871518,
title = {Process system and method for fabricating submicron field emission cathodes},
author = {Jankowski, Alan F. and Hayes, Jeffrey P.},
abstractNote = {A process method and system for making field emission cathodes exists. The deposition source divergence is controlled to produce field emission cathodes with height-to-base aspect ratios that are uniform over large substrate surface areas while using very short source-to-substrate distances. The rate of hole closure is controlled from the cone source. The substrate surface is coated in well defined increments. The deposition source is apertured to coat pixel areas on the substrate. The entire substrate is coated using a manipulator to incrementally move the whole substrate surface past the deposition source. Either collimated sputtering or evaporative deposition sources can be used. The position of the aperture and its size and shape are used to control the field emission cathode size and shape.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1998},
month = {1}
}

Patent:

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