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Title: Compression molding of aerogel microspheres

Abstract

An aerogel composite material produced by compression molding of aerogel microspheres (powders) mixed together with a small percentage of polymer binder to form monolithic shapes in a cost-effective manner. The aerogel composites are formed by mixing aerogel microspheres with a polymer binder, placing the mixture in a mold and heating under pressure, which results in a composite with a density of 50-800 kg/m.sup.3 (0.05-0.80 g/cc). The thermal conductivity of the thus formed aerogel composite is below that of air, but higher than the thermal conductivity of monolithic aerogels. The resulting aerogel composites are attractive for applications such as thermal insulation since fabrication thereof does not require large and expensive processing equipment. In addition to thermal insulation, the aerogel composites may be utilized for filtration, ICF target, double layer capacitors, and capacitive deionization.

Inventors:
 [1];  [2]
  1. Pleasant Hill, CA
  2. Pleasanton, CA
Publication Date:
Research Org.:
Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)
OSTI Identifier:
871435
Patent Number(s):
US 5731360
Application Number:
08/610621
Assignee:
Regents of University of California (Oakland, CA)
DOE Contract Number:  
W-7405-ENG-48
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
compression; molding; aerogel; microspheres; composite; material; produced; powders; mixed; percentage; polymer; binder; form; monolithic; shapes; cost-effective; manner; composites; formed; mixing; placing; mixture; mold; heating; pressure; results; density; 50-800; kg; 05-0; 80; cc; thermal; conductivity; below; air; aerogels; resulting; attractive; applications; insulation; fabrication; require; expensive; processing; equipment; addition; utilized; filtration; icf; target; double; layer; capacitors; capacitive; deionization; material produced; polymer binder; layer capacitors; aerogel composites; layer capacitor; aerogel microspheres; thermal insulation; thermal conductivity; composite material; double layer; capacitive deionization; aerogel composite; processing equipment; icf target; compression molding; compression mold; composite mat; formed aerogel; monolithic aerogel; cost-effective manner; /521/

Citation Formats

Pekala, Richard W, and Hrubesh, Lawrence W. Compression molding of aerogel microspheres. United States: N. p., 1998. Web.
Pekala, Richard W, & Hrubesh, Lawrence W. Compression molding of aerogel microspheres. United States.
Pekala, Richard W, and Hrubesh, Lawrence W. 1998. "Compression molding of aerogel microspheres". United States. https://www.osti.gov/servlets/purl/871435.
@article{osti_871435,
title = {Compression molding of aerogel microspheres},
author = {Pekala, Richard W and Hrubesh, Lawrence W},
abstractNote = {An aerogel composite material produced by compression molding of aerogel microspheres (powders) mixed together with a small percentage of polymer binder to form monolithic shapes in a cost-effective manner. The aerogel composites are formed by mixing aerogel microspheres with a polymer binder, placing the mixture in a mold and heating under pressure, which results in a composite with a density of 50-800 kg/m.sup.3 (0.05-0.80 g/cc). The thermal conductivity of the thus formed aerogel composite is below that of air, but higher than the thermal conductivity of monolithic aerogels. The resulting aerogel composites are attractive for applications such as thermal insulation since fabrication thereof does not require large and expensive processing equipment. In addition to thermal insulation, the aerogel composites may be utilized for filtration, ICF target, double layer capacitors, and capacitive deionization.},
doi = {},
url = {https://www.osti.gov/biblio/871435}, journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Mar 24 00:00:00 EST 1998},
month = {Tue Mar 24 00:00:00 EST 1998}
}

Works referenced in this record:

Carbon Aerogels: An Update on Structure, Properties, and Applications
book, January 1994