Ultrafast optical technique for the characterization of altered materials
- Barrington, RI
Disclosed herein is a method and a system for non-destructively examining a semiconductor sample (30) having at least one localized region underlying a surface (30a) through into which a selected chemical species has been implanted or diffused. A first step induces at least one transient time-varying change in optical constants of the sample at a location at or near to a surface of the sample. A second step measures a response of the sample to an optical probe beam, either pulsed or continuous wave, at least during a time that the optical constants are varying. A third step associates the measured response with at least one of chemical species concentration, chemical species type, implant energy, a presence or absence of an introduced chemical species region at the location, and a presence or absence of implant-related damage. The method and apparatus in accordance with this invention can be employed in conjunction with a measurement of one or more of the following effects arising from a time-dependent change in the optical constants of the sample due to the application of at least one pump pulse: (a) a change in reflected intensity; (b) a change in transmitted intensity; (c) a change in a polarization state of the reflected and/or transmitted light; (d) a change in the optical phase of the reflected and/or transmitted light; (e) a change in direction of the reflected and/or transmitted light; and (f) a change in optical path length between the sample's surface and a detector.
- Research Organization:
- Brown Univ., Providence, RI (United States)
- DOE Contract Number:
- FG02-86ER45267
- Assignee:
- Brown University Research Foundation (Providence, RI)
- Patent Number(s):
- US 5706094
- OSTI ID:
- 871314
- Country of Publication:
- United States
- Language:
- English
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Related Subjects
optical
technique
characterization
altered
materials
disclosed
method
non-destructively
examining
semiconductor
sample
30
localized
region
underlying
surface
30a
selected
chemical
species
implanted
diffused
step
induces
transient
time-varying
change
constants
location
near
measures
response
probe
beam
pulsed
continuous
wave
time
varying
third
associates
measured
concentration
type
implant
energy
presence
absence
introduced
implant-related
damage
apparatus
accordance
employed
conjunction
measurement
following
effects
arising
time-dependent
due
application
pump
pulse
reflected
intensity
transmitted
polarization
light
phase
direction
path
length
detector
optical constants
transmitted light
third step
optical phase
continuous wave
probe beam
pump pulse
path length
optical path
chemical species
optical probe
transmitted intensity
chemical specie
localized region
selected chemical
semiconductor sample
optical technique
measured response
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