X-ray lithography using holographic images

Patent · Wed Jan 01 00:00:00 EST 1997

OSTI ID:870875

Howells, Malcolm S ^[1]; Jacobsen, Chris ^[2]

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1. Berkeley, CA
2. Sound Beach, NY

Methods for forming X-ray images having 0.25 .mu.m minimum line widths on X-ray sensitive material are presented. A holgraphic image of a desired circuit pattern is projected onto a wafer or other image-receiving substrate to allow recording of the desired image in photoresist material. In one embodiment, the method uses on-axis transmission and provides a high flux X-ray source having modest monochromaticity and coherence requirements. A layer of light-sensitive photoresist material on a wafer with a selected surface is provided to receive the image(s). The hologram has variable optical thickness and variable associated optical phase angle and amplitude attenuation for transmission of the X-rays. A second embodiment uses off-axis holography. The wafer receives the holographic image by grazing incidence reflection from a hologram printed on a flat metal or other highly reflecting surface or substrate. In this second embodiment, an X-ray beam with a high degree of monochromaticity and spatial coherence is required.

• Research Organization: Lawrence Berkeley National Laboratory (LBNL), Berkeley, CA (United States)
• DOE Contract Number: AC03-76SF00098
• Assignee: Lawrence Berkeley Laboratory, University of CA (Berkeley, CA)
• Patent Number(s): US 5612986
• OSTI ID: 870875
• Country of Publication: United States
• Language: English

Related Subjects

x-ray
lithography
holographic
images
methods
forming
25
minimum
line
widths
sensitive
material
holgraphic
image
desired
circuit
pattern
projected
wafer
image-receiving
substrate
allow
recording
photoresist
embodiment
method
on-axis
transmission
provides
flux
source
modest
monochromaticity
coherence
requirements
layer
light-sensitive
selected
surface
provided
receive
hologram
variable
optical
thickness
associated
phase
angle
amplitude
attenuation
x-rays
off-axis
holography
receives
grazing
incidence
reflection
printed
flat
metal
highly
reflecting
beam
degree
spatial
required
x-ray image
selected surface
optical phase
optical thickness
resist material
x-ray lithography
phase angle
x-ray source
x-ray beam
reflecting surface
circuit pattern
sensitive material
x-ray sensitive
photoresist material
holographic image
holographic images
line width
line widths
x-ray images
minimum line
ray sensitive
desired circuit
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