X-ray lithography using holographic images
Patent
·
OSTI ID:870875
- Berkeley, CA
- Sound Beach, NY
Methods for forming X-ray images having 0.25 .mu.m minimum line widths on X-ray sensitive material are presented. A holgraphic image of a desired circuit pattern is projected onto a wafer or other image-receiving substrate to allow recording of the desired image in photoresist material. In one embodiment, the method uses on-axis transmission and provides a high flux X-ray source having modest monochromaticity and coherence requirements. A layer of light-sensitive photoresist material on a wafer with a selected surface is provided to receive the image(s). The hologram has variable optical thickness and variable associated optical phase angle and amplitude attenuation for transmission of the X-rays. A second embodiment uses off-axis holography. The wafer receives the holographic image by grazing incidence reflection from a hologram printed on a flat metal or other highly reflecting surface or substrate. In this second embodiment, an X-ray beam with a high degree of monochromaticity and spatial coherence is required.
- Research Organization:
- Lawrence Berkeley National Laboratory (LBNL), Berkeley, CA
- DOE Contract Number:
- AC03-76SF00098
- Assignee:
- Lawrence Berkeley Laboratory, University of CA (Berkeley, CA)
- Patent Number(s):
- US 5612986
- OSTI ID:
- 870875
- Country of Publication:
- United States
- Language:
- English
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Related Subjects
/378/
25
allow
amplitude
angle
associated
attenuation
beam
circuit
circuit pattern
coherence
degree
desired
desired circuit
embodiment
flat
flux
forming
grazing
highly
holgraphic
hologram
holographic
holographic image
holographic images
holography
image
image-receiving
images
incidence
layer
light-sensitive
line
line width
line widths
lithography
material
metal
method
methods
minimum
minimum line
modest
monochromaticity
off-axis
on-axis
optical
optical phase
optical thickness
pattern
phase
phase angle
photoresist
photoresist material
printed
projected
provided
provides
ray sensitive
receive
receives
recording
reflecting
reflecting surface
reflection
required
requirements
resist material
selected
selected surface
sensitive
sensitive material
source
spatial
substrate
surface
thickness
transmission
variable
wafer
widths
x-ray
x-ray beam
x-ray image
x-ray images
x-ray lithography
x-ray sensitive
x-ray source
x-rays
25
allow
amplitude
angle
associated
attenuation
beam
circuit
circuit pattern
coherence
degree
desired
desired circuit
embodiment
flat
flux
forming
grazing
highly
holgraphic
hologram
holographic
holographic image
holographic images
holography
image
image-receiving
images
incidence
layer
light-sensitive
line
line width
line widths
lithography
material
metal
method
methods
minimum
minimum line
modest
monochromaticity
off-axis
on-axis
optical
optical phase
optical thickness
pattern
phase
phase angle
photoresist
photoresist material
printed
projected
provided
provides
ray sensitive
receive
receives
recording
reflecting
reflecting surface
reflection
required
requirements
resist material
selected
selected surface
sensitive
sensitive material
source
spatial
substrate
surface
thickness
transmission
variable
wafer
widths
x-ray
x-ray beam
x-ray image
x-ray images
x-ray lithography
x-ray sensitive
x-ray source
x-rays