Method and system for evaluating integrity of adherence of a conductor bond to a mating surface of a substrate

Patent · 31 December 1995

OSTI ID:870505

Telschow, Kenneth L ^[1]; Siu, Bernard K ^[2]

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1. Idaho Falls, ID
2. Diamond Bar, CA

A method of evaluating integrity of adherence of a conductor bond to a substrate includes: a) impinging a plurality of light sources onto a substrate; b) detecting optical reflective signatures emanating from the substrate from the impinged light; c) determining location of a selected conductor bond on the substrate from the detected reflective signatures; d) determining a target site on the selected conductor bond from the detected reflective signatures; e) optically imparting an elastic wave at the target site through the selected conductor bond and into the substrate; f) optically detecting an elastic wave signature emanating from the substrate resulting from the optically imparting step; and g) determining integrity of adherence of the selected conductor bond to the substrate from the detected elastic wave signature emanating from the substrate. A system is disclosed which is capable of conducting the method.

• Research Organization: EG & G IDAHO INC
• DOE Contract Number: AC07-76ID01570
• Assignee: Lockheed Idaho Technologies Company (Idaho Falls, ID)
• Patent Number(s): US 5535006
• OSTI ID: 870505
• Country of Publication: United States
• Language: English

Related Subjects

/356/250/
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conducting
conductor
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elastic
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