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Title: Metallization of electronic insulators

Abstract

An electroplated element is formed to include an insulating substrate, a conducting polymer polymerized in situ on the substrate, and a metal layer deposited on the conducting polymer. In one application a circuit board is formed by polymerizing pyrrole on an epoxy-fiberglass substrate in a single step process and then electrodepositing a metal over the resulting polypyrrole polymer. No chemical deposition of the metal is required prior to electroplating and the resulting layer of substrate-polymer-metal has excellent adhesion characteristics. The metal deposition is surprisingly smooth and uniform over the relatively high resistance film of polypyrrole. A continuous manufacturing process is obtained by filtering the solution between successive substrates to remove polymer formed in the solution, by maintaining the solution oxidizing potential within selected limits, and by adding a strong oxidant, such as KMnO.sub.4 at periodic intervals to maintain a low sheet resistivity in the resulting conducting polymer film.

Inventors:
 [1];  [1]
  1. (Los Alamos, NM)
Publication Date:
Research Org.:
Los Alamos National Laboratory (LANL), Los Alamos, NM
OSTI Identifier:
869623
Patent Number(s):
US 5368717
Assignee:
Regents of University of California, Office of Technology (Alameda, CA) LANL
DOE Contract Number:  
W-7405-ENG-36
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
metallization; electronic; insulators; electroplated; element; formed; insulating; substrate; conducting; polymer; polymerized; situ; metal; layer; deposited; application; circuit; board; polymerizing; pyrrole; epoxy-fiberglass; single; step; process; electrodepositing; resulting; polypyrrole; chemical; deposition; required; prior; electroplating; substrate-polymer-metal; excellent; adhesion; characteristics; surprisingly; smooth; uniform; relatively; resistance; film; continuous; manufacturing; obtained; filtering; solution; successive; substrates; remove; maintaining; oxidizing; potential; selected; limits; adding; strong; oxidant; kmno; periodic; intervals; maintain; sheet; resistivity; chemical deposition; manufacturing process; single step; polymer film; circuit board; metal layer; glass substrate; layer deposited; conducting polymer; metal deposition; step process; adhesion characteristics; selected limit; insulating substrate; metal deposit; oxidizing potential; /205/

Citation Formats

Gottesfeld, Shimshon, and Uribe, Francisco A. Metallization of electronic insulators. United States: N. p., 1994. Web.
Gottesfeld, Shimshon, & Uribe, Francisco A. Metallization of electronic insulators. United States.
Gottesfeld, Shimshon, and Uribe, Francisco A. Sat . "Metallization of electronic insulators". United States. https://www.osti.gov/servlets/purl/869623.
@article{osti_869623,
title = {Metallization of electronic insulators},
author = {Gottesfeld, Shimshon and Uribe, Francisco A.},
abstractNote = {An electroplated element is formed to include an insulating substrate, a conducting polymer polymerized in situ on the substrate, and a metal layer deposited on the conducting polymer. In one application a circuit board is formed by polymerizing pyrrole on an epoxy-fiberglass substrate in a single step process and then electrodepositing a metal over the resulting polypyrrole polymer. No chemical deposition of the metal is required prior to electroplating and the resulting layer of substrate-polymer-metal has excellent adhesion characteristics. The metal deposition is surprisingly smooth and uniform over the relatively high resistance film of polypyrrole. A continuous manufacturing process is obtained by filtering the solution between successive substrates to remove polymer formed in the solution, by maintaining the solution oxidizing potential within selected limits, and by adding a strong oxidant, such as KMnO.sub.4 at periodic intervals to maintain a low sheet resistivity in the resulting conducting polymer film.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1994},
month = {1}
}

Patent:

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